MPC860TVR50D4 vs MPC860SRCVR50D4 Comparison

This in-depth comparison of the MPC860TVR50D4 and MPC860SRCVR50D4 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MPC860TVR50D4

+BOM

2566 PCS | NXP USA Inc.
MPC860SRCVR50D4

+BOM

7545 PCS | NXP USA Inc.
Package BGA-357 BBGA-357
Description IC MPU MPC8XX 50MHZ 357BGA IC MPU MPC8XX 50MHZ 357BGA
Supplier - NXP USA Inc.
Series MPC8xx MPC8xx
Part Status Obsolete Obsolete
Core Processor MPC8xx MPC8xx
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 50MHz 50MHz
Co - Processors / DSP Communications; CPM Communications; CPM
RAM Controllers DRAM DRAM
Graphics Acceleration No No
Ethernet 10Mbps (4), 10/100Mbps (1) 10Mbps (4)
Voltage - I / O 3.3V 3.3V
Operating Temperature 0°C ~ 95°C (TA) -40°C ~ 95°C (TA)
Comparison Model : MPC860TVR50D4 MPC860SRCVR50D4

+BOM RFQ