MPC870VR66 vs MPC875VR133

This in-depth comparison of the MPC870VR66 and MPC875VR133 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MPC870VR66

NXP USA Inc.

Lifecycle
Active
Stock
621 PCS
Package
BBGA-256
Series
Embedded - Microprocessors
+BOM RFQ
Part B

MPC875VR133

NXP USA Inc.

Lifecycle
Active
Stock
4536 PCS
Package
BBGA-256
Series
Embedded - Microprocessors
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MPC870VR66 MPC875VR133
Supplier Rochester Electronics, LLC,NXP USA Inc. NXP USA Inc.
Series MPC8xx MPC8xx
Part Status Obsolete Obsolete
Core Processor MPC8xx MPC8xx
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 66MHz 133MHz
Co - Processors / DSP Communications; CPM Communications; CPM, Security; SEC
RAM Controllers DRAM DRAM
Graphics Acceleration No No
Ethernet 10/100Mbps (2) 10Mbps (1), 10/100Mbps (2)
USB USB 2.0 (1) USB 2.0 (1)
Voltage - I / O 3.3V 3.3V
Operating Temperature 0°C ~ 95°C (TA) 0°C ~ 95°C (TA)
Security Features - Cryptography
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