MPC885VR133 vs MPC880VR66

This in-depth comparison of the MPC885VR133 and MPC880VR66 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

ISO9001 Quality Control ISO45001 ISO14001 100% Genuine
Part A

MPC885VR133

NXP USA Inc.

Lifecycle
Active
Stock
6440 PCS
Package
BBGA-357
Series
Embedded - Microprocessors
+BOM RFQ
Part B

MPC880VR66

NXP USA Inc.

Lifecycle
Active
Stock
4972 PCS
Package
BBGA-357
Series
Embedded - Microprocessors
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MPC885VR133 MPC880VR66
Supplier NXP USA Inc. Rochester Electronics, LLC,NXP USA Inc.
Series MPC8xx MPC8xx
Part Status Obsolete Obsolete
Core Processor MPC8xx MPC8xx
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 133MHz 66MHz
Co - Processors / DSP Communications; CPM, Security; SEC Communications; CPM
RAM Controllers DRAM DRAM
Graphics Acceleration No No
Ethernet 10Mbps (3), 10/100Mbps (2) 10Mbps (2), 10/100Mbps (2)
USB USB 2.0 (1) USB 2.0 (1)
Voltage - I / O 3.3V 3.3V
Operating Temperature 0°C ~ 95°C (TA) 0°C ~ 95°C (TA)
Security Features Cryptography -
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