MPX2100DP vs MPX2100AP

This in-depth comparison of the MPX2100DP and MPX2100AP provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MPX2100DP

STMicroelectronics

Lifecycle: Active
Stock: 1961 PCS
Series: Pressure Sensors, Transducers

+BOM RFQ

Part B

MPX2100AP

NXP USA Inc.

Lifecycle: Active
Stock: 3690 PCS
Package: SIP-4
Series: Pressure Sensors, Transducers

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	MPX2100DP	MPX2100AP
Series	MPX2100	MPX2100
Part Status	Obsolete	Active
Applications	Board Mount	Board Mount
Pressure Type	Differential	Absolute
Operating Pressure	14.5PSI (100kPa)	14.5PSI (100kPa)
Output Type	Wheatstone Bridge	Wheatstone Bridge
Output	0 mV ~ 40 mV (10V)	0 mV ~ 40 mV (10V)
Voltage - Supply	10V ~ 16V	10V ~ 16V
Port Size	Male - 0.19" (4.93mm) Tube, Dual	Male - 0.19 (4.93mm) Tube
Port Style	Barbed	Barbed
Features	Temperature Compensated	Temperature Compensated
Termination Style	PC Pin	PC Pin
Maximum Pressure	58.02PSI (400kPa)	58.02PSI (400kPa)
Operating Temperature	-40°C ~ 125°C	-40°C ~ 125°C
Base Product Number	MPX2100	-
Mounting Type	Through Hole	-
Packaging	Tray	-

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