MR25H256ACDF vs MR25H256CDF

This in-depth comparison of the MR25H256ACDF and MR25H256CDF provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MR25H256ACDF

Everspin Technologies Inc.

Lifecycle
Active
Stock
2060 PCS
Package
VDFN-8
Series
Memory
+BOM RFQ
Part B

MR25H256CDF

Everspin Technologies Inc.

Lifecycle
Active
Stock
4762 PCS
Package
VDFN-8
Series
Memory
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MR25H256ACDF MR25H256CDF
Part Status Active Not For New Designs
Memory Type Non-Volatile Non-Volatile
Memory Format RAM RAM
Technology MRAM (Magnetoresistive RAM) MRAM (Magnetoresistive RAM)
Memory Size 256Kb (32K x 8) 256Kb (32K x 8)
Memory Interface SPI SPI
Clock Frequency 40 MHz 40 MHz
Voltage - Supply 2.7V ~ 3.6V 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
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