PIC12F508-I/P vs PIC12F752-E/P

This in-depth comparison of the PIC12F508-I/P and PIC12F752-E/P provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

PIC12F508-I/P

Microchip Technology

Lifecycle: Active
Stock: 5268 PCS
Package: DIP-8
Series: Embedded - Microcontrollers

+BOM RFQ

Part B

PIC12F752-E/P

Microchip Technology

Lifecycle: Active
Stock: 6411 PCS
Package: DIP-8
Series: Embedded - Microcontrollers

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	PIC12F508-I/P	PIC12F752-E/P
Supplier	-	Microchip Technology
Series	PIC® 12F	PIC® 12F
Part Status	Active	Active
Core Processor	PIC	PIC
Core Size	8-Bit	8-Bit
Speed	4MHz	20MHz
Peripherals	POR, WDT	Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O	5	5
Program Memory Size	768B (512 x 12)	1.75KB (1K x 14)
Program Memory Type	FLASH	FLASH
RAM Size	25 x 8	64 x 8
Voltage - Supply (Vcc/Vdd)	2V ~ 5.5V	2V ~ 5.5V
Data Converters	-	A/D 4x10b; D/A 1x5b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 125°C (TA)
Mounting Type	Through Hole	Through Hole

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