PIC16F1825-E/ST vs PIC16F1823-E/ST

This in-depth comparison of the PIC16F1825-E/ST and PIC16F1823-E/ST provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

PIC16F1825-E/ST

Microchip Technology

Lifecycle
Active
Stock
1976 PCS
Package
TSSOP-14
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

PIC16F1823-E/ST

Microchip Technology

Lifecycle
Active
Stock
1672 PCS
Package
TSSOP-14
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification PIC16F1825-E/ST PIC16F1823-E/ST
Series PIC® XLP™ mTouch™ 16F PIC® XLP™ 16F
Part Status Active Active
Core Processor PIC PIC
Core Size 8-Bit 8-Bit
Speed 32MHz 32MHz
Connectivity I²C, LINbus, SPI, UART/USART I²C, LINbus, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, WDT Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O 11 12
Program Memory Size 14KB (8K x 14) 3.5KB (2K x 14)
Program Memory Type FLASH FLASH
EEPROM Size 256 x 8 256 x 8
RAM Size 1K x 8 128 x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 5.5V 1.8V ~ 5.5V
Data Converters A/D 8x10b A/D 8x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount
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