PIC16F684-I/P vs PIC16F727-E/P

This in-depth comparison of the PIC16F684-I/P and PIC16F727-E/P provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

PIC16F684-I/P

Microchip Technology

Lifecycle
Active
Stock
6512 PCS
Package
PDIP-14
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

PIC16F727-E/P

Microchip Technology

Lifecycle
Active
Stock
5007 PCS
Package
DIP-40
Series
Embedded - Microcontrollers
+BOM RFQ

Need help validating a replacement?

Send your BOM and application constraints for technical and sourcing review.

RFQ Contact technical support

Full specification comparison

Use manufacturer datasheets as the final authority.

Specification PIC16F684-I/P PIC16F727-E/P
Supplier - Microchip Technology
Series PIC® 16F PIC® XLP™ 16F
Part Status Active Active
Core Processor PIC PIC
Core Size 8-Bit 8-Bit
Speed 20MHz 20MHz
Connectivity - I²C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, WDT Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O 12 36
Program Memory Size 3.5KB (2K x 14) 14KB (8K x 14)
Program Memory Type FLASH FLASH
RAM Size 128 x 8 368 x 8
Voltage - Supply (Vcc/Vdd) 2V ~ 5.5V 1.8V ~ 5.5V
Data Converters A/D 8x10b A/D 14x8b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 125°C (TA)
Mounting Type Through Hole Through Hole
EEPROM Size 256 x 8 -
Compare RFQ