PIC16F74-I/P vs PIC16C770-E/P

This in-depth comparison of the PIC16F74-I/P and PIC16C770-E/P provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

PIC16F74-I/P

Microchip Technology

Lifecycle: Active
Stock: 4261 PCS
Package: DIP-40
Series: Embedded - Microcontrollers

+BOM RFQ

Part B

PIC16C770-E/P

Microchip Technology

Lifecycle: Active
Stock: 5640 PCS
Package: DIP-20
Series: Embedded - Microcontrollers

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	PIC16F74-I/P	PIC16C770-E/P
Supplier	-	Microchip Technology
Series	PIC® 16F	PIC® 16C
Part Status	Active	Obsolete
Core Processor	PIC	PIC
Core Size	8-Bit	8-Bit
Speed	20MHz	20MHz
Connectivity	I²C, SPI, UART/USART	I²C, SPI
Peripherals	Brown-out Detect/Reset, POR, PWM, WDT	Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O	33	15
Program Memory Size	7KB (4K x 14)	3.5KB (2K x 14)
Program Memory Type	FLASH	OTP
RAM Size	192 x 8	256 x 8
Voltage - Supply (Vcc/Vdd)	4V ~ 5.5V	4V ~ 5.5V
Data Converters	A/D 8x8b	A/D 6x12b
Oscillator Type	External	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 125°C (TA)
Mounting Type	Through Hole	Through Hole

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