PIC18F4431-I/P vs PIC18F4682-E/P

This in-depth comparison of the PIC18F4431-I/P and PIC18F4682-E/P provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

ISO9001 Quality Control ISO45001 ISO14001 100% Genuine
Part A

PIC18F4431-I/P

Microchip Technology

Lifecycle
Active
Stock
3037 PCS
Package
PDIP-40
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

PIC18F4682-E/P

Microchip Technology

Lifecycle
Active
Stock
4280 PCS
Package
DIP-40
Series
Embedded - Microcontrollers
+BOM RFQ

Need help validating a replacement?

Send your BOM and application constraints for technical and sourcing review.

RFQ Contact technical support

Full specification comparison

Use manufacturer datasheets as the final authority.

Specification PIC18F4431-I/P PIC18F4682-E/P
Supplier - Microchip Technology
Series PIC® 18F PIC® 18F
Part Status Active Active
Core Processor PIC PIC
Core Size 8-Bit 8-Bit
Speed 40MHz 40MHz
Connectivity I²C, SPI, UART/USART CANbus, I²C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, LVD, Power Control PWM, QEI, POR, PWM, WDT Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number of I/O 36 36
Program Memory Size 16KB (8K x 16) 80KB (40K x 16)
Program Memory Type FLASH FLASH
EEPROM Size 256 x 8 1K x 8
RAM Size 768 x 8 3.25K x 8
Voltage - Supply (Vcc/Vdd) 4.2V ~ 5.5V 4.2V ~ 5.5V
Data Converters A/D 9x10b A/D 11x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 125°C (TA)
Mounting Type Through Hole Through Hole
Compare RFQ