PIC18F4550-I/P vs PIC18C242-E/SP

This in-depth comparison of the PIC18F4550-I/P and PIC18C242-E/SP provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

PIC18F4550-I/P

Microchip Technology

Lifecycle
Active
Stock
5844 PCS
Package
DIP-40
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

PIC18C242-E/SP

Microchip Technology

Lifecycle
Active
Stock
6309 PCS
Package
DIP-28
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification PIC18F4550-I/P PIC18C242-E/SP
Supplier - Microchip Technology
Series PIC® 18F PIC® 18C
Part Status Active Active
Core Processor PIC PIC
Core Size 8-Bit 8-Bit
Speed 48MHz 40MHz
Connectivity I²C, SPI, UART/USART, USB I²C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, HLVD, POR, PWM, WDT Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number of I/O 35 22
Program Memory Size 32KB (16K x 16) 16KB (8K x 16)
Program Memory Type FLASH OTP
RAM Size 2K x 8 512 x 8
Voltage - Supply (Vcc/Vdd) 4.2V ~ 5.5V 4.2V ~ 5.5V
Data Converters A/D 13x10b A/D 5x10b
Oscillator Type Internal External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 125°C (TA)
Mounting Type Through Hole Through Hole
EEPROM Size 256 x 8 -
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