S9S08DZ60F2MLC vs S9S08RN16W2MLC

This in-depth comparison of the S9S08DZ60F2MLC and S9S08RN16W2MLC provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

S9S08DZ60F2MLC

NXP USA Inc.

Lifecycle
Active
Stock
7339 PCS
Package
LQFP-32
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

S9S08RN16W2MLC

NXP USA Inc.

Lifecycle
Active
Stock
8173 PCS
Package
LQFP-32
Series
Embedded - Microcontrollers
+BOM RFQ

Need help validating a replacement?

Send your BOM and application constraints for technical and sourcing review.

RFQ Contact technical support

Full specification comparison

Use manufacturer datasheets as the final authority.

Specification S9S08DZ60F2MLC S9S08RN16W2MLC
Supplier - NXP USA Inc.
Series S08 S08
Part Status Active Active
Core Processor S08 S08
Core Size 8-Bit 8-Bit
Speed 40MHz 20MHz
Connectivity CANbus, I²C, LINbus, SCI, SPI I²C, LINbus, SPI, UART/USART
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM, WDT
Number of I/O 25 26
Program Memory Size 60KB (60K x 8) 16KB (16K x 8)
Program Memory Type FLASH FLASH
EEPROM Size 2K x 8 256 x 8
RAM Size 4K x 8 2K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V 2.7V ~ 5.5V
Data Converters A/D 10x12b A/D 12x12b
Oscillator Type External Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount
Compare RFQ