S9S08SG4E2MTJ vs S9S08DZ60F2MLF

This in-depth comparison of the S9S08SG4E2MTJ and S9S08DZ60F2MLF provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

ISO9001 Quality Control ISO45001 ISO14001 100% Genuine
Part A

S9S08SG4E2MTJ

NXP USA Inc.

Lifecycle
Active
Stock
8920 PCS
Package
TSSOP-20
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

S9S08DZ60F2MLF

Freescale Semiconductor

Lifecycle
Active
Stock
5066 PCS
Package
SOT313-3
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification S9S08SG4E2MTJ S9S08DZ60F2MLF
Supplier NXP USA Inc. -
Series S08 S08
Part Status Active Active
Core Processor S08 S08
Core Size 8-Bit 8-Bit
Speed 40MHz 40MHz
Connectivity I²C, LINbus, SCI, SPI CANbus, I²C, LINbus, SCI, SPI
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM, WDT
Number of I/O 16 39
Program Memory Size 4KB (4K x 8) 60KB (60K x 8)
Program Memory Type FLASH FLASH
RAM Size 256 x 8 4K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V 2.7V ~ 5.5V
Data Converters A/D 12x10b A/D 16x12b
Oscillator Type Internal External
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount
EEPROM Size - 2K x 8
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