S9S08DZ96F2MLH vs S9S08SG4E2MTJ

This in-depth comparison of the S9S08DZ96F2MLH and S9S08SG4E2MTJ provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

ISO9001 Quality Control ISO45001 ISO14001 100% Genuine
Part A

S9S08DZ96F2MLH

NXP USA Inc.

Lifecycle
Active
Stock
6765 PCS
Package
SOT1699-1
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

S9S08SG4E2MTJ

NXP USA Inc.

Lifecycle
Active
Stock
8920 PCS
Package
TSSOP-20
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification S9S08DZ96F2MLH S9S08SG4E2MTJ
Supplier - NXP USA Inc.
Series S08 S08
Part Status Active Active
Core Processor S08 S08
Core Size 8-Bit 8-Bit
Speed 40MHz 40MHz
Connectivity CANbus, I²C, LINbus, SCI, SPI I²C, LINbus, SCI, SPI
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM, WDT
Number of I/O 53 16
Program Memory Size 96KB (96K x 8) 4KB (4K x 8)
Program Memory Type FLASH FLASH
RAM Size 6K x 8 256 x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V 2.7V ~ 5.5V
Data Converters A/D 24x12b A/D 12x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount
EEPROM Size 2K x 8 -
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