S9S08SG4E2MTJ vs S9S08SG4E2CTJ Comparison

This in-depth comparison of the S9S08SG4E2MTJ and S9S08SG4E2CTJ provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
S9S08SG4E2MTJ

+BOM

8920 PCS | NXP USA Inc.
S9S08SG4E2CTJ

+BOM

6544 PCS | NXP USA Inc.
Package TSSOP-20 TSSOP-20
Description IC MCU 8BIT 4KB FLASH 20TSSOP IC MCU 8BIT 4KB FLASH 20TSSOP
Supplier NXP USA Inc. NXP USA Inc.
Series S08 S08
Part Status Active Active
Core Processor S08 S08
Core Size 8-Bit 8-Bit
Speed 40MHz 40MHz
Connectivity I²C, LINbus, SCI, SPI I²C, LINbus, SCI, SPI
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM, WDT
Number of I/O 16 16
Program Memory Size 4KB (4K x 8) 4KB (4K x 8)
Program Memory Type FLASH FLASH
RAM Size 256 x 8 256 x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V 2.7V ~ 5.5V
Data Converters A/D 12x10b A/D 12x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Comparison Model : S9S08SG4E2MTJ S9S08SG4E2CTJ

+BOM RFQ