SPC5604BF2MLQ6 vs SPC5601DF1VLL4

This in-depth comparison of the SPC5604BF2MLQ6 and SPC5601DF1VLL4 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

ISO9001 Quality Control ISO45001 ISO14001 100% Genuine
Part A

SPC5604BF2MLQ6

NXP USA Inc.

Lifecycle
Active
Stock
4028 PCS
Package
SOT486-2
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

SPC5601DF1VLL4

NXP USA Inc.

Lifecycle
Active
Stock
3449 PCS
Package
LQFP-100
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification SPC5604BF2MLQ6 SPC5601DF1VLL4
Supplier - Rochester Electronics, LLC,NXP USA Inc.
Series MPC56xx Qorivva MPC56xx Qorivva
Part Status Active Active
Core Processor e200z0h e200z0h
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 64MHz 48MHz
Connectivity CANbus, I²C, LINbus, SCI, SPI CANbus, LINbus, SCI, SPI
Peripherals DMA, POR, PWM, WDT DMA, POR, PWM, WDT
Number of I/O 123 79
Program Memory Size 512KB (512K x 8) 128KB (128K x 8)
Program Memory Type FLASH FLASH
EEPROM Size 64K x 8 4K x 16
RAM Size 32K x 8 12K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V 3V ~ 5.5V
Data Converters A/D 36x10b A/D 33x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 105°C (TA)
Mounting Type Surface Mount Surface Mount
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