SPC5606BK0MLU6 vs SPC5673FF3MVR3

This in-depth comparison of the SPC5606BK0MLU6 and SPC5673FF3MVR3 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

SPC5606BK0MLU6

NXP USA Inc.

Lifecycle
Active
Stock
2902 PCS
Package
SOT506-2
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

SPC5673FF3MVR3

NXP USA Inc.

Lifecycle
Active
Stock
2479 PCS
Package
BBGA-416
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification SPC5606BK0MLU6 SPC5673FF3MVR3
Supplier - NXP USA Inc.
Series MPC56xx Qorivva MPC56xx Qorivva
Part Status Active Active
Core Processor e200z0h e200z7
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 64MHz 264MHz
Connectivity CANbus, I²C, LINbus, SCI, SPI CANbus, SCI, SPI
Peripherals DMA, POR, PWM, WDT DMA, POR, PWM
Number of I/O 149 32
Program Memory Size 1MB (1M x 8) 3MB (3M x 8)
Program Memory Type FLASH FLASH
RAM Size 80K x 8 192K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V 1.08V ~ 5.25V
Data Converters A/D 29x10b, 5x12b A/D 64x12b
Oscillator Type Internal External
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount
EEPROM Size 64K x 8 -
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