SPC560D30L1B4E0X vs SPC5604EEF2MLHR

This in-depth comparison of the SPC560D30L1B4E0X and SPC5604EEF2MLHR provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

SPC560D30L1B4E0X

STMicroelectronics

Lifecycle
Active
Stock
6976 PCS
Package
LQFP-64
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

SPC5604EEF2MLHR

NXP USA Inc.

Lifecycle
Active
Stock
7954 PCS
Package
LQFP-64
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification SPC560D30L1B4E0X SPC5604EEF2MLHR
Series Automotive, AEC-Q100, SPC56 MPC56xx Qorivva
Part Status Active Active
Core Processor e200z0h e200z0h
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 48MHz 64MHz
Connectivity CANbus, LINbus, SPI, UART/USART CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals DMA, LVD, POR, PWM, WDT DMA, POR, WDT
Number of I/O 45 39
Program Memory Size 128KB (128K x 8) 512KB (512K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - 64K x 8
RAM Size 12K x 8 96K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V 3V ~ 3.6V
Data Converters A/D 16x12b A/D 4x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount
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