SPC560P44L3CEFAR vs SPC5633MF2MLU60

This in-depth comparison of the SPC560P44L3CEFAR and SPC5633MF2MLU60 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

ISO9001 Quality Control ISO45001 ISO14001 100% Genuine
Part A

SPC560P44L3CEFAR

STMicroelectronics

Lifecycle
Active
Stock
3485 PCS
Package
LQFP-100
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

SPC5633MF2MLU60

NXP USA Inc.

Lifecycle
Active
Stock
9051 PCS
Package
LQFP-176
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification SPC560P44L3CEFAR SPC5633MF2MLU60
Supplier - NXP USA Inc.
Series Automotive, AEC-Q100, SPC56 MPC56xx Qorivva
Part Status Active Active
Core Processor e200z0h e200z3
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 64MHz 60MHz
Connectivity CANbus, LINbus, SPI, UART/USART CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals DMA, POR, PWM, WDT DMA, POR, PWM, WDT
Number of I/O 67 80
Program Memory Size 384KB (384K x 8) 1MB (1M x 8)
Program Memory Type FLASH FLASH
RAM Size 36K x 8 64K x 8
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V 4.5V ~ 5.25V
Data Converters A/D 26x10b A/D 34x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount
EEPROM Size 64K x 8 -
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