SPC5634MF2MLQ80 vs SPC5602BF2MLL4

This in-depth comparison of the SPC5634MF2MLQ80 and SPC5602BF2MLL4 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

SPC5634MF2MLQ80

NXP USA Inc.

Lifecycle
Active
Stock
6263 PCS
Package
LQFP-144
Series
Embedded - Microcontrollers
Part B

SPC5602BF2MLL4

NXP USA Inc.

Lifecycle
Active
Stock
4048 PCS
Package
LQFP-100
Series
Embedded - Microcontrollers

Need help validating a replacement?

Send your BOM and application constraints for technical and sourcing review.

Full specification comparison

Use manufacturer datasheets as the final authority.

Specification SPC5634MF2MLQ80 SPC5602BF2MLL4
Series MPC56xx Qorivva MPC56xx Qorivva
Part Status Active Active
Core Processor e200z3 e200z0h
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 80MHz 48MHz
Connectivity CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART CANbus, I²C, LINbus, SCI, SPI
Peripherals DMA, POR, PWM, WDT DMA, POR, PWM, WDT
Number of I/O 80 79
Program Memory Size 1.5MB (1.5M x 8) 256KB (256K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - 64K x 8
RAM Size 94K x 8 24K x 8
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.25V 3V ~ 5.5V
Data Converters A/D 32x12b A/D 28x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount