ST62T01CB6 vs ST62T55CB6

This in-depth comparison of the ST62T01CB6 and ST62T55CB6 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

ST62T01CB6

STMicroelectronics

Lifecycle
Active
Stock
1389 PCS
Package
PDIP-16
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

ST62T55CB6

STMicroelectronics

Lifecycle
Active
Stock
9577 PCS
Package
DIP-28
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification ST62T01CB6 ST62T55CB6
Supplier - STMicroelectronics
Series ST6 ST6
Part Status Obsolete Obsolete
Core Processor ST6 ST6
Core Size 8-Bit 8-Bit
Speed 8MHz 8MHz
Connectivity - SPI
Peripherals LVD, POR, WDT LED, LVD, POR, WDT
Number of I/O 9 21
Program Memory Size 2KB (2K x 8) 3.8KB (3.8K x 8)
Program Memory Type OTP OTP
RAM Size 64 x 8 128 x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 6V 3V ~ 6V
Data Converters A/D 4x8b A/D 13x8b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Through Hole Through Hole
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