ST62T60CB6 vs ST62T09CB6

This in-depth comparison of the ST62T60CB6 and ST62T09CB6 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

ST62T60CB6

STMicroelectronics

Lifecycle
Active
Stock
5934 PCS
Package
PDIP-20
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

ST62T09CB6

STMicroelectronics

Lifecycle
Active
Stock
2896 PCS
Package
DIP-20
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification ST62T60CB6 ST62T09CB6
Supplier - STMicroelectronics
Series ST6 ST6
Part Status Obsolete Obsolete
Core Processor ST6 ST6
Core Size 8-Bit 8-Bit
Speed 8MHz 8MHz
Peripherals LED, LVD, POR, WDT LVD, POR, WDT
Number of I/O 13 12
Program Memory Size 3.8KB (3.8K x 8) 1KB (1K x 8)
Program Memory Type OTP OTP
RAM Size 128 x 8 64 x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 6V 3V ~ 6V
Data Converters A/D 7x8b A/D 4x8b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Through Hole Through Hole
Connectivity SPI -
EEPROM Size 128 x 8 -
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