TLE9834QXXUMA2 vs TLE98322QVXUMA2

This in-depth comparison of the TLE9834QXXUMA2 and TLE98322QVXUMA2 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

TLE9834QXXUMA2

Infineon Technologies

Lifecycle: Active
Stock: 8866 PCS
Package: VFQFN-48
Series: Embedded - Microcontrollers - Application Specific

+BOM RFQ

Part B

TLE98322QVXUMA2

Infineon Technologies

Lifecycle: Active
Stock: 7829 PCS
Package: VFQFN-48
Series: Embedded - Microcontrollers - Application Specific

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	TLE9834QXXUMA2	TLE98322QVXUMA2
Supplier	Infineon Technologies,Rochester Electronics, LLC	Infineon Technologies
Part Status	Obsolete	Obsolete
Applications	Automotive	Automotive
Core Processor	XC800	XC800
Program Memory Type	FLASH (64kB)	FLASH (36kB)
RAM Size	3.25K x 8	3.25K x 8
Interface	LIN, SSI, UART	LIN, SSI, UART
Number of I/O	11	11
Voltage - Supply	3V ~ 27V	3V ~ 27V
Operating Temperature	-40°C ~ 150°C (TJ)	-40°C ~ 150°C (TJ)
Mounting Type	Surface Mount	Surface Mount

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