TSV912IDT vs TSV911AID

This in-depth comparison of the TSV912IDT and TSV911AID provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

TSV912IDT

UMW

Lifecycle: Active
Stock: 7260 PCS
Series: Linear - Amplifiers - Instrumentation, Op Amps, Buffer Amps

+BOM RFQ

Part B

TSV911AID

STMicroelectronics

Lifecycle: Active
Stock: 3313 PCS
Package: SOIC-8
Series: Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	TSV912IDT	TSV911AID
Supplier	-	STMicroelectronics
Part Status	Active	Obsolete
Amplifier Type	Standard (General Purpose)	General Purpose
Number of Circuits	2	1
Output Type	Single Ended, Rail-to-Rail	Rail-to-Rail
Slew Rate	4.5V/µs	4.5V/µs
Gain Bandwidth Product	8 MHz	8 MHz
Current - Input Bias	1 pA	1 pA
Supply Current	780µA (x2 Channels)	820µA
Current - Output / Channel	35 mA	35 mA
Voltage - Supply Span(Min)	-	2.5 V
Voltage - Supply Span(Max)	-	5.5 V
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 125°C
Mounting Type	Surface Mount	Surface Mount
Series	TSV91x	-
Voltage - Input Offset	100 µV	-
Voltage - Supply Span (Min)	2.5 V	-
Voltage - Supply Span (Max)	5.5 V	-
Packaging	Cut Tape (CT), Tape & Reel (TR)	-

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