W25Q64BVSFIG vs W25Q64DWSFIG

This in-depth comparison of the W25Q64BVSFIG and W25Q64DWSFIG provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

W25Q64BVSFIG

Winbond Electronics

Lifecycle
Active
Stock
6037 PCS
Series
Memory - Memory
+BOM RFQ
Part B

W25Q64DWSFIG

Winbond Electronics

Lifecycle
Active
Stock
7045 PCS
Package
SOIC-16
Series
Memory
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification W25Q64BVSFIG W25Q64DWSFIG
Series SpiFlash® SpiFlash®
Part Status Obsolete Obsolete
Memory Type Non-Volatile Non-Volatile
Memory Format FLASH FLASH
Technology FLASH - NOR FLASH - NOR
Memory Size 64Mbit 64Mb (8M x 8)
Memory Interface SPI SPI - Quad I/O, QPI
Clock Frequency 80 MHz 104 MHz
Write Cycle Time - Word Page - 3ms
Voltage - Supply 2.7V ~ 3.6V 1.7V ~ 1.95V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Base Product Number W25Q64 -
Digi Key Programmable Verified -
Memory Organization 8M x 8 -
Write Cycle Time - Word, Page 3ms -
Packaging Tube -
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