XC3S1400A-4FGG484C vs XC3S1400A-4FTG256C

This in-depth comparison of the XC3S1400A-4FGG484C and XC3S1400A-4FTG256C provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

XC3S1400A-4FGG484C

AMD Xilinx

Lifecycle
Active
Stock
3341 PCS
Package
BGA-484
Series
Embedded - FPGAs (Field Programmable Gate Array)
+BOM RFQ
Part B

XC3S1400A-4FTG256C

AMD Xilinx

Lifecycle
Active
Stock
7099 PCS
Package
BGA-256
Series
Embedded - FPGAs (Field Programmable Gate Array)
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification XC3S1400A-4FGG484C XC3S1400A-4FTG256C
Series Spartan®-3A Spartan®-3A
Part Status Active Active
Number of LABs/CLBs 2816 2816
Number of Logic Elements/Cells 25344 25344
Total RAM Bits 589824 589824
Number of I/O 375 161
Number of Gates 1400000 1400000
Voltage - Supply 1.14V ~ 1.26V 1.14V ~ 1.26V
Mounting Type Surface Mount Surface Mount
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
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