XC3S400A-4FGG320C vs XC3S400A-4FTG256C Comparison

This in-depth comparison of the XC3S400A-4FTG256C and XC3S400A-4FGG320C provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
XC3S400A-4FTG256C

+BOM

6366 PCS | AMD Xilinx
XC3S400A-4FGG320C

+BOM

1485 PCS | AMD Xilinx
Package BGA-256 BGA-320
Description IC FPGA 195 I/O 256FTBGA IC FPGA 251 I/O 320FBGA
Series Spartan®-3A Spartan®-3A
Part Status Active Active
Number of LABs/CLBs 896 896
Number of Logic Elements/Cells 8064 8064
Total RAM Bits 368640 368640
Number of I/O 195 251
Number of Gates 400000 400000
Voltage - Supply 1.14V ~ 1.26V 1.14V ~ 1.26V
Mounting Type Surface Mount Surface Mount
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Comparison Model : XC3S400A-4FTG256C XC3S400A-4FGG320C

+BOM RFQ