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Home / Package / NI-780S-2L2LA

NI-780S-2L2LA

Mfr.Part# Description Manufacturer In Stock Operation
A2T18S160W31SR3 IC TRANS RF LDMOS NXP USA Inc. 5419

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A2T18S162W31SR3 IC TRANS RF LDMOS NXP USA Inc. 6855

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AFT18S260W31SR3 IC TRANS RF LDMOS NXP USA Inc. 6613

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Other Package

  • 32-TSSOP
  • 7-Ultra Thin-Pak
  • TO-220-3 Full Pack
  • 3AB, 3AG, 1/4 x 1-1/4
  • 40-WFQFN Exposed Pad
  • 28-LCC Module
  • 72-WFQFN Exposed Pad
  • Ring, Wire Leads
  • 176-TFBGA
  • 55LV
  • 152-VBGA
  • DO-216AA
  • 81-BLGA
  • 40-VQFN Exposed Pad
  • 16-LSOP (0.220", 5.60mm Width) + 2 Heat Tabs

Hot Package

  • 10-DIP(0.300",7.62mm)
  • 16-SOIC (0.154, 3.90mm Width)
  • 48-VFQFN Exposed Pad
  • 100-TFBGA
  • 8 MSOP
  • 8-Pin SOIC(NB)
  • 8-SOIC (0.154, 3.90mm Width)
  • µDFN-6
  • 12-WFQFN Exposed Pad
  • PG-SOT223-4
  • TO-226-3, TO-92-3 (TO-226AA)
  • 10-TFSOP
  • 10-SMD
  • 10-MINI_SO-N/A
  • 3-SC-70

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