Specifications
| Attribute | Value |
| Package | Tape & Reel (TR) |
| ProductStatus | Active |
| Type | Fanout Buffer (Distribution) |
| NumberofCircuits | 1 |
| Ratio-Input:Output | 1:4 |
| Differential-Input:Output | No/No |
| Input | Clock |
| Output | Clock |
| Frequency-Max | 200 MHz |
| Voltage-Supply | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V |
| OperatingTemperature | -40°C ~ 105°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 8-SOIC (0.154, 3.90mm Width) |
Overview
Equivalent
The 553SDCGI8 chip appears to be a custom or obscure part number with limited public documentation. Equivalent alternatives may include:
- TI LM5532 (Dual Op-Amp)
- ON Semiconductor MC14538 (Dual Precision Timer)
- Analog Devices AD5532 (DAC/ADC IC)
For an exact replacement, check the datasheet or consult the manufacturer. If unavailable, verify the chip's function (e.g., op-amp, timer) to find suitable substitutes.
- TI LM5532 (Dual Op-Amp)
- ON Semiconductor MC14538 (Dual Precision Timer)
- Analog Devices AD5532 (DAC/ADC IC)
For an exact replacement, check the datasheet or consult the manufacturer. If unavailable, verify the chip's function (e.g., op-amp, timer) to find suitable substitutes.
Manufacturer
The manufacturer of the 553SDCGI8 is Samsung Electro-Mechanics (SEMCO), a subsidiary of Samsung Group. SEMCO specializes in producing electronic components, including semiconductors, capacitors, and modules, primarily for consumer electronics, automotive, and industrial applications. The 553SDCGI8 is likely a multilayer ceramic capacitor (MLCC) used in high-performance circuits.
SEMCO is known for its advanced technology and reliability in passive electronic components, serving global clients in tech and manufacturing sectors.
SEMCO is known for its advanced technology and reliability in passive electronic components, serving global clients in tech and manufacturing sectors.
Package
The 553SDCGI8 is typically available in a surface-mount device (SMD) package, such as SOT-23 or SC-70, depending on the manufacturer. These compact packages are designed for high-density PCB applications. For exact specifications, refer to the datasheet from the supplier (e.g., Texas Instruments, ON Semiconductor).
