AS4C64M8D2-25BIN

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AS4C64M8D2-25BIN

+BOM

IC DRAM 512MBIT PARALLEL 60FBGA

  • ManufacturerAlliance Memory, Inc.

  • Mfr. Part #AS4C64M8D2-25BIN

  • In Stock8049

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Specifications

Attribute Value
Part Status Active
Digi Key Programmable Not Verified
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - DDR2
Memory Size 512Mbit
Memory Organization 64M x 8
Memory Interface Parallel
Write Cycle Time - Word, Page 15ns
Voltage - Supply 1.7V ~ 1.9V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 60-TFBGA
Supplier Device Package 60-FBGA (8x10)
Base Product Number AS4C64
Clock Frequency 400 MHz
Access Time 400 ps

Overview

Description

The AS4C64M8D2-25BIN is a type of DRAM memory chip, specifically a 512Mb (megabit) DDR2 (Double Data Rate 2) SDRAM component. It is designed for use in various electronic devices requiring high-speed data storage and retrieval. The "64M8" denotes the configuration of the memory, with 64 megabits per eight banks, and the "25" refers to the speed grade, indicating a cycle time of 2.5 nanoseconds, which translates to a data rate of 400 MHz (800 Mbps effective due to DDR). The "BIN" in the model number typically specifies the packaging and temperature grade, suitable for standard commercial use.
This chip supports features like auto-refresh and self-refresh, and it's designed for low power consumption, making it suitable for mobile and battery-powered applications. It operates on a 1.8V power supply, which is standard for DDR2 memory. The AS4C64M8D2-25BIN is utilized in various applications, including computers, networking devices, and consumer electronics, where efficient memory performance is crucial.

Equivalent

The AS4C64M8D2-25BIN is a 512Mb DDR2 SDRAM chip. Equivalent products from other manufacturers include the MT47H64M8B6 from Micron, the H5PS5162GFR from SK Hynix, and the K4T1G164QF from Samsung. These chips share similar specifications such as memory size, speed, and form factor, and can typically be used interchangeably in compatible systems. Always verify specific compatibility with your application or consult the datasheet for detailed specifications.

Features

The AS4C64M8D2-25BIN is a SDRAM memory module with the following features:
1. Organization: 64M x 8 (512 Megabit) configuration.
2. Speed: Operates at a clock frequency with a cycle time of 25 ns (nanoseconds).
3. Voltage: Typically operates at a power supply voltage of 3.3V.
4. Interface: SDR (Single Data Rate) interface for data transactions.
5. Package: Available in a 54-pin TSOP II (Thin Small Outline Package).
6. Temperature Range: Industrial temperature range from -40°C to +85°C, suitable for a wide range of applications.
7. Performance: Supports burst mode for better performance and efficiency in data handling.
8. Row Access: Features multiple banks and rows for simultaneous access and higher data throughput.
9. Compatibility: Compatible with a wide range of microcontrollers and processors in embedded systems.
10. Applications: Ideal for use in industrial, automotive, and other demanding environments requiring reliable memory solutions.
These features make the AS4C64M8D2-25BIN suitable for applications requiring robust and efficient memory operations.

Pinout

The AS4C64M8D2-25BIN is a 512Mb (megabit) DDR2 SDRAM chip, organized as 64M x 8 bits. This chip is typically housed in a 60-ball FBGA (Fine-Pitch Ball Grid Array) package. The 60-ball FBGA package indicates that it has 60 pins (or balls) for connectivity.
The primary functions of the AS4C64M8D2-25BIN include:
1. Data Storage: It provides volatile storage for data, organized in 64 million rows with 8-bit wide data paths.
2. High-Speed Data Transfer: DDR2 technology allows for fast data transfer rates due to its double data rate architecture.
3. Buffering and Caching: It can be used for temporary buffering and caching of data for processors and other devices.
4. Memory Initialization: Supports initialization procedures for memory configurations and refresh cycles.
5. Low Power Consumption: Enhanced power efficiency compared to older memory technologies.
These functions make it suitable for use in a variety of applications, including computers, networking devices, and consumer electronics where high-speed memory is required.

Manufacturer

The AS4C64M8D2-25BIN is manufactured by Alliance Memory. Alliance Memory is a company that specializes in the production of legacy memory products. The company focuses on providing long-term support for a range of DRAM and SRAM products that are often no longer offered by the original manufacturers. This includes a variety of memory types such as synchronous DRAM (SDRAM), double data rate (DDR) SDRAM, and more. Alliance Memory's product offerings are critical for industries that require stable and long-term supply chains for memory components in products where redesigning or upgrading the memory technology is not feasible. The company is known for its commitment to continuity of supply, product availability, and customer service.

Application

The AS4C64M8D2-25BIN is a 512Mb DDR2 SDRAM memory chip used in various applications requiring efficient data processing and storage. Common application areas include:
1. Consumer Electronics: Such as digital cameras, set-top boxes, and gaming consoles, where fast data retrieval and processing are crucial.
2. Computing: In desktops and laptops, enhancing system performance through speedy memory access.
3. Networking: Used in routers and switches to handle large data traffic.
4. Industrial Applications: For embedded systems and control units requiring reliable and high-speed memory.
5. Telecommunications: In devices needing quick data access and processing capabilities for seamless communication.
These applications benefit from the chip's high data bandwidth and low power consumption.

Package

The AS4C64M8D2-25BIN is a DDR2 SDRAM memory chip typically packaged in a 60-ball FBGA (Fine-Pitch Ball Grid Array).

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