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AS4C64M8D2-25BIN
+BOMIC DRAM 512MBIT PARALLEL 60FBGA
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ManufacturerAlliance Memory, Inc.
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Mfr. Part #AS4C64M8D2-25BIN
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In Stock8049
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Specifications
| Attribute | Value |
| Part Status | Active |
| Digi Key Programmable | Not Verified |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM - DDR2 |
| Memory Size | 512Mbit |
| Memory Organization | 64M x 8 |
| Memory Interface | Parallel |
| Write Cycle Time - Word, Page | 15ns |
| Voltage - Supply | 1.7V ~ 1.9V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 60-TFBGA |
| Supplier Device Package | 60-FBGA (8x10) |
| Base Product Number | AS4C64 |
| Clock Frequency | 400 MHz |
| Access Time | 400 ps |
Overview
Description
This chip supports features like auto-refresh and self-refresh, and it's designed for low power consumption, making it suitable for mobile and battery-powered applications. It operates on a 1.8V power supply, which is standard for DDR2 memory. The AS4C64M8D2-25BIN is utilized in various applications, including computers, networking devices, and consumer electronics, where efficient memory performance is crucial.
Equivalent
Features
1. Organization: 64M x 8 (512 Megabit) configuration.
2. Speed: Operates at a clock frequency with a cycle time of 25 ns (nanoseconds).
3. Voltage: Typically operates at a power supply voltage of 3.3V.
4. Interface: SDR (Single Data Rate) interface for data transactions.
5. Package: Available in a 54-pin TSOP II (Thin Small Outline Package).
6. Temperature Range: Industrial temperature range from -40°C to +85°C, suitable for a wide range of applications.
7. Performance: Supports burst mode for better performance and efficiency in data handling.
8. Row Access: Features multiple banks and rows for simultaneous access and higher data throughput.
9. Compatibility: Compatible with a wide range of microcontrollers and processors in embedded systems.
10. Applications: Ideal for use in industrial, automotive, and other demanding environments requiring reliable memory solutions.
These features make the AS4C64M8D2-25BIN suitable for applications requiring robust and efficient memory operations.
Pinout
The primary functions of the AS4C64M8D2-25BIN include:
1. Data Storage: It provides volatile storage for data, organized in 64 million rows with 8-bit wide data paths.
2. High-Speed Data Transfer: DDR2 technology allows for fast data transfer rates due to its double data rate architecture.
3. Buffering and Caching: It can be used for temporary buffering and caching of data for processors and other devices.
4. Memory Initialization: Supports initialization procedures for memory configurations and refresh cycles.
5. Low Power Consumption: Enhanced power efficiency compared to older memory technologies.
These functions make it suitable for use in a variety of applications, including computers, networking devices, and consumer electronics where high-speed memory is required.
Manufacturer
Application
1. Consumer Electronics: Such as digital cameras, set-top boxes, and gaming consoles, where fast data retrieval and processing are crucial.
2. Computing: In desktops and laptops, enhancing system performance through speedy memory access.
3. Networking: Used in routers and switches to handle large data traffic.
4. Industrial Applications: For embedded systems and control units requiring reliable and high-speed memory.
5. Telecommunications: In devices needing quick data access and processing capabilities for seamless communication.
These applications benefit from the chip's high data bandwidth and low power consumption.