BCM75839UPKFEBA03G

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BCM75839UPKFEBA03G

+BOM

SOC SET TOP BOX IC

  • ManufacturerBroadcom Limited

  • Mfr. Part #BCM75839UPKFEBA03G

  • In Stock2696

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Specifications

Attribute Value
ProductStatus Obsolete

Overview

Description

The BCM75839UPKFEBA03G appears to be a specific model number or part number, likely related to a piece of technology, such as a semiconductor, microcontroller, or integrated circuit. Unfortunately, without specific documentation or context, it's difficult to provide precise details about this model. Generally, such codes are used by manufacturers like Broadcom, Qualcomm, or other technology companies to categorize and identify their products. These products are typically used in electronics for processing tasks, communication functions, or other specialized purposes. If you are looking for detailed specifications or application information, you would need to consult the manufacturer's datasheet or technical documentation associated with the product. This documentation would provide information on the product's features, capabilities, and potential applications. If you're in need of technical support or more specific details, reaching out to the manufacturer's customer service or technical support team would be advisable.

Equivalent

The BCM75839UPKFEBA03G is a specific model of a Broadcom set-top box (STB) system-on-chip (SoC). For equivalent products, consider similar SoCs from other manufacturers such as:
1. STMicroelectronics' STiH410 series.
2. MediaTek's MT5592 series.
3. Amlogic's S905X series.
These are alternatives in terms of functionality and target applications, though exact equivalence may vary based on specific feature sets and performance metrics. Always check detailed specifications for precise compatibility.

Features

The BCM75839UPKFEBA03G is a Broadcom set-top box system-on-chip (SoC) designed for digital TV and multimedia applications. Key features typically include:
1. High-Performance Processing: Equipped with a powerful CPU and often a GPU for handling complex tasks and high-definition video decoding.

2. Video Decoding: Supports multiple video formats, including MPEG-2, H.264, and possibly newer codecs like H.265/HEVC, for high-quality streaming and playback.
3. Connectivity Options: Includes various interfaces such as HDMI, USB, Ethernet, and possibly wireless connectivity options depending on the configuration.
4. Advanced Security: Incorporates content protection technologies and encryption standards to securely deliver premium content.
5. Energy Efficiency: Designed to consume low power, making it suitable for always-on applications like set-top boxes.
6. Enhanced Audio: Supports advanced audio formats for an improved audio experience.
Note: Specific features can vary based on configurations and updates from the manufacturer. Always refer to the official documentation for the most accurate and detailed information.

Manufacturer

The BCM75839UPKFEBA03G is a product manufactured by Broadcom Inc. Broadcom is a global technology company known for designing, developing, and supplying a wide range of semiconductor and infrastructure software solutions. The company focuses on delivering products for the data center, networking, software, broadband, wireless, and industrial markets. Broadcom's offerings include chips for networking devices, storage systems, broadband communications, and more, catering to various sectors including telecommunications, enterprise, and industrial applications.

Application

The BCM75839UPKFEBA03G is typically used in set-top boxes and digital TV applications. It supports advanced video decoding, security functions, and connectivity features essential for delivering high-definition content. Additionally, it's suitable for over-the-top (OTT) streaming devices, IPTV solutions, and hybrid TV systems, providing robust processing power and efficient interface capabilities. This chip enhances user experience through interactive TV services, media playback, and Internet-based content access, making it ideal for modern home entertainment systems.

Package

The package type for BCM75839UPKFEBA03G is typically a Ball Grid Array (BGA). This is a common packaging for integrated circuits, providing a high-density connection with solder balls arranged in a grid pattern on the underside of the package.

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