Specifications
| Attribute | Value |
| Package | Tape & Reel (TR),Cut Tape (CT),Bulk |
| Series | NexFET™ |
| ProductStatus | Active |
| FETType | 2 N-Channel (Dual) |
| FETFeature | Logic Level Gate |
| DraintoSourceVoltage(Vdss) | 30V |
| Current-ContinuousDrain(Id)@25°C | 40A |
| RdsOn(Max)@IdVgs | 5.9mOhm @ 20A, 8V |
| Vgs(th)(Max)@Id | 2.1V @ 250µA |
| GateCharge(Qg)(Max)@Vgs | 10.9nC @ 4.5V |
| InputCapacitance(Ciss)(Max)@Vds | 1770pF @ 15V |
| Power-Max | 12W |
| OperatingTemperature | -55°C ~ 150°C (TJ) |
| MountingType | Surface Mount |
| Package/Case | 8-PowerLDFN |
Overview
Description
"CSD87350Q5D" appears to be a model number, likely for a specific electronic component or semiconductor device, but without additional context, it is difficult to provide a detailed introduction specific to this model. Generally, such model numbers could refer to a type of MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor), IGBT (Insulated Gate Bipolar Transistor), or another semiconductor product used in power management applications. These components are typically utilized to control power flow in various electronic circuits, supporting efficient power conversion, switching, or amplification.
To understand this specific model, one should consult the datasheet provided by the manufacturer, which will include technical specifications such as voltage and current ratings, thermal characteristics, and application notes. The datasheet will also offer guidance on how to integrate the component into electronic designs. For precise information, identifying the manufacturer and accessing their official documentation is essential. If further details are required, please provide more context or verify the model number for accuracy.
To understand this specific model, one should consult the datasheet provided by the manufacturer, which will include technical specifications such as voltage and current ratings, thermal characteristics, and application notes. The datasheet will also offer guidance on how to integrate the component into electronic designs. For precise information, identifying the manufacturer and accessing their official documentation is essential. If further details are required, please provide more context or verify the model number for accuracy.
Equivalent
The CSD87350Q5D is a dual NexFET power block from Texas Instruments, commonly used in synchronous buck converters. Equivalent products can include:
1. NXP Semiconductor's LFPAK series.
2. Infineon's OptiMOS series.
3. ON Semiconductor's FDMF series.
It is important to verify electrical specifications such as voltage, current ratings, and thermal performance to ensure compatibility. Checking footprints and pin configurations for drop-in replacements is also crucial.
1. NXP Semiconductor's LFPAK series.
2. Infineon's OptiMOS series.
3. ON Semiconductor's FDMF series.
It is important to verify electrical specifications such as voltage, current ratings, and thermal performance to ensure compatibility. Checking footprints and pin configurations for drop-in replacements is also crucial.
Features
The CSD87350Q5D is a Power Block from Texas Instruments, optimized for high-efficiency applications. Here are its key features:
1. Dual MOSFETs: It integrates a high-side and low-side N-channel MOSFET in a single package for high current and fast switching.
2. High Efficiency: Designed for optimized thermal performance with low power loss, making it suitable for applications requiring efficient power management.
3. Small Footprint: Comes in a compact 5 mm x 6 mm SON (Small Outline No-lead) package, saving space on the PCB.
4. High Frequency: Supports high-frequency synchronous buck converters, which is ideal for use in point-of-load (POL) applications.
5. Low RDS(on): Features low on-resistance for both high-side and low-side MOSFETs, reducing conduction losses.
6. Current Handling: Capable of handling high current loads, suitable for demanding applications.
7. Thermal Performance: Enhanced thermal characteristics for reliable operation in high-power environments.
8. Integration: Simplifies the design by integrating two MOSFETs, reducing component count and improving reliability.
These features make the CSD87350Q5D ideal for use in high-efficiency, compact power supply designs.
1. Dual MOSFETs: It integrates a high-side and low-side N-channel MOSFET in a single package for high current and fast switching.
2. High Efficiency: Designed for optimized thermal performance with low power loss, making it suitable for applications requiring efficient power management.
3. Small Footprint: Comes in a compact 5 mm x 6 mm SON (Small Outline No-lead) package, saving space on the PCB.
4. High Frequency: Supports high-frequency synchronous buck converters, which is ideal for use in point-of-load (POL) applications.
5. Low RDS(on): Features low on-resistance for both high-side and low-side MOSFETs, reducing conduction losses.
6. Current Handling: Capable of handling high current loads, suitable for demanding applications.
7. Thermal Performance: Enhanced thermal characteristics for reliable operation in high-power environments.
8. Integration: Simplifies the design by integrating two MOSFETs, reducing component count and improving reliability.
These features make the CSD87350Q5D ideal for use in high-efficiency, compact power supply designs.
Pinout
The CSD87350Q5D is a dual NexFET power block MOSFET from Texas Instruments. It typically comes in a SON 5 mm x 6 mm package and features a total of 10 pins. This device is designed to work as a half-bridge power stage for synchronous buck applications, providing high efficiency and power density.
The pin functions are generally as follows:
1. BOOT - Bootstrap capacitor connection for the high-side FET driver supply.
2. PWM - Pulse Width Modulation input for controlling the FETs.
3. SW - Switch node, connected to the output inductor.
4. VIN - Input voltage supply.
5. GND - Ground.
6. VOUT - Output voltage.
The package includes several pins dedicated to these functions to facilitate thermal management and electrical connectivity. The CSD87350Q5D is often used in high-current, high-frequency DC-DC converters. Always refer to the datasheet for precise electrical characteristics and pin configuration.
The pin functions are generally as follows:
1. BOOT - Bootstrap capacitor connection for the high-side FET driver supply.
2. PWM - Pulse Width Modulation input for controlling the FETs.
3. SW - Switch node, connected to the output inductor.
4. VIN - Input voltage supply.
5. GND - Ground.
6. VOUT - Output voltage.
The package includes several pins dedicated to these functions to facilitate thermal management and electrical connectivity. The CSD87350Q5D is often used in high-current, high-frequency DC-DC converters. Always refer to the datasheet for precise electrical characteristics and pin configuration.
Manufacturer
The CSD87350Q5D is manufactured by Texas Instruments (TI). Texas Instruments is a global semiconductor company that designs and manufactures a wide range of electronic products and components, with a focus on analog and embedded processing technologies. TI’s offerings are widely used in various industries, including automotive, industrial, personal electronics, communications equipment, and enterprise systems. As a leader in the semiconductor industry, Texas Instruments provides solutions that help companies enhance performance and efficiency in their electronic devices.
Application
The CSD87350Q5D is a half-bridge power block designed for DC-DC power conversion applications. It is commonly used in areas such as synchronous buck converters, high-frequency switch-mode power supplies, and point-of-load (POL) converters. These applications are prevalent in computing, data centers, telecommunications, servers, and networking equipment, where efficient power management is crucial. The device's high efficiency and compact size make it suitable for high-density power applications, enhancing the performance and reducing the power losses in electronic systems.
Package
The CSD87350Q5D is a power block MOSFET from Texas Instruments and comes in a DualCool™ package. It features a 5x6 mm SON (Small Outline No-lead) package type, designed for high-efficiency power switching applications.
