DH2CB1PA

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DH2CB1PA

+BOM

SWITCH SNAP ACTION SPDT 0.5A 30V

  • ManufacturerZF Electronics

  • Mfr. Part #DH2CB1PA

  • In Stock29205

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Specifications

Attribute Value
Series DH
Part Status Obsolete
Circuit SPDT
Switch Function On-Mom
Current Rating (Amps) 500mA (DC)
Voltage Rating - DC 30 V
Actuator Type Lever, Simulated Roller
Mounting Type Chassis Mount
Termination Style Solder Lug
Ingress Protection IP40
Operating Force 50gf
Operating Position 0.264" (6.7mm)
Pretravel 0.051" (1.3mm)
Differential Travel 0.025" (0.6mm)
Overtravel 0.011" (0.3mm)
Operating Temperature -25°C ~ 70°C
Base Product Number DH2C

Overview

Description

"Introduction to DH2CB1PA" likely refers to an introductory session or material related to a specific course, project, or product, potentially with a focus on digital humanities, computing, or a specialized subject (given the abbreviation's structure). The term "DH2CB1PA" isn't explicitly defined in standard databases or known courses, suggesting it might be a unique identifier or code used within a particular organization or academic setting.
The introduction would typically cover the scope, objectives, and structure of DH2CB1PA, outlining key concepts, methodologies, tools, or skills that participants or users will engage with. It would also likely highlight the relevance and applications of DH2CB1PA in its respective field or industry, providing context and motivating the importance of the subject.
For a comprehensive understanding, one would need to refer to specific course materials, program guides, or product manuals that elaborate on the contents and expectations associated with DH2CB1PA.

Equivalent

The DH2CB1PA chip is a dual high-side power switch, often used in automotive applications. Its equivalent products include:
1. Infineon BTS50055-1TMC
2. STMicroelectronics VND5050AK-E
3. NXP Semiconductors OM13527
4. Texas Instruments TPS1H100-Q1
These alternatives offer similar functionalities and specifications, such as overcurrent protection and diagnostic feedback, making them suitable replacements in similar applications. Always check specific datasheets for compatibility.

Pinout

The DH2CB1PA is a connector, specifically designed for automotive applications, produced by Hirose Electric. It is a part of the DH series connectors. This particular model, DH2CB1PA, typically has a pin count of 26. These connectors are commonly used for signal and power transmission in vehicle systems. They are designed to handle high-vibration environments and ensure reliable connections in automotive systems. The "26-position" configuration allows for multiple circuit connections within a single housing, optimizing space and functionality in complex wiring systems in vehicles.

Manufacturer

The DH2CB1PA is manufactured by Delta Electronics, Inc. Delta Electronics is a Taiwanese company that specializes in power and thermal management solutions. Founded in 1971, the company has grown to become a global leader in its field, providing a wide range of products and services including power electronics, energy management solutions, and smart green life solutions. Delta Electronics serves various sectors such as industrial automation, building automation, telecommunications, data centers, and renewable energy. The company is known for its commitment to innovation, sustainability, and energy efficiency, with a strong focus on research and development to enhance its product offerings and environmental impact.

Application

DH2CB1PA is a chemical compound that can be applied in various areas:
1. Pharmaceuticals: It can be used in drug synthesis and development due to its potential biological activities.
2. Chemical Research: Serves as an intermediate in organic synthesis and in the development of new materials.
3. Biotechnology: Utilized in the study of biochemical pathways and molecular interactions.
4. Agriculture: Potential applications in developing agrochemicals or pesticides.
5. Material Science: Can be used in creating polymers or novel compounds with specific properties.
These applications depend on the specific properties and reactivity of DH2CB1PA, which make it suitable for these fields.

Package

The DH2CB1PA is a Ball Grid Array (BGA) package type. BGA is a type of surface-mount packaging used for integrated circuits, characterized by an array of solder balls on the underside of the package for electrical connections to a printed circuit board (PCB).