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EF2L45BG256B
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ManufacturerJLCPCB Assembly
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Mfr. Part #EF2L45BG256B
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In Stock20800
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Specifications
| Attribute | Value |
| Manufacturer | JLCPCB Assembly |
| Package | FBGA-256 |
Overview
Description
The EF2L45BG256B is a Field-Programmable Gate Array (FPGA) from Efinix, part of their Trion series. Key features include:
- 45K logic elements for flexible digital design.
- Low-power 40nm process for energy efficiency.
- 256-pin BGA package, suitable for compact applications.
- High-speed I/O and embedded memory for performance.
- Efinix’s Quantum architecture, enabling efficient routing.
It’s ideal for edge computing, IoT, and embedded systems due to its balance of power, performance, and cost. For exact specs, refer to Efinix’s datasheet.
- 45K logic elements for flexible digital design.
- Low-power 40nm process for energy efficiency.
- 256-pin BGA package, suitable for compact applications.
- High-speed I/O and embedded memory for performance.
- Efinix’s Quantum architecture, enabling efficient routing.
It’s ideal for edge computing, IoT, and embedded systems due to its balance of power, performance, and cost. For exact specs, refer to Efinix’s datasheet.
Equivalent
The EF2L45BG256B is a FPGA chip from Efinix. Direct equivalents are rare, but similar alternatives include:
- Lattice ECP5 (LFE5UM-45F-8BG256C)
- Intel Cyclone IV (EP4CE40F23C8N)
- Xilinx Spartan-6 (XC6SLX45-2CSG324C)
These offer comparable logic density and features. Always verify pin compatibility and specifications for your design.
- Lattice ECP5 (LFE5UM-45F-8BG256C)
- Intel Cyclone IV (EP4CE40F23C8N)
- Xilinx Spartan-6 (XC6SLX45-2CSG324C)
These offer comparable logic density and features. Always verify pin compatibility and specifications for your design.
Features
The EF2L45BG256B is a low-power FPGA from Efinix, featuring:
- 45K Logic Elements: Suitable for mid-range applications.
- Low Power: Optimized for energy efficiency.
- 256-ball BGA Package: Compact and high-density.
- Efinix Trion Architecture: Combines logic, DSP, and memory efficiently.
- High-Speed I/O: Supports various protocols (LVDS, PCIe, etc.).
- On-Chip Memory: Includes embedded RAM blocks.
- Flexible DSP Blocks: For arithmetic and signal processing.
- 1.2V Core Voltage: Reduces power consumption.
- Fast Configuration: Quick boot times.
Ideal for IoT, edge computing, and embedded systems.
- 45K Logic Elements: Suitable for mid-range applications.
- Low Power: Optimized for energy efficiency.
- 256-ball BGA Package: Compact and high-density.
- Efinix Trion Architecture: Combines logic, DSP, and memory efficiently.
- High-Speed I/O: Supports various protocols (LVDS, PCIe, etc.).
- On-Chip Memory: Includes embedded RAM blocks.
- Flexible DSP Blocks: For arithmetic and signal processing.
- 1.2V Core Voltage: Reduces power consumption.
- Fast Configuration: Quick boot times.
Ideal for IoT, edge computing, and embedded systems.
Application
The EF2L45BG256B is a Field-Programmable Gate Array (FPGA) typically used in:
1. Embedded Systems – For custom logic and control.
2. Communications – Signal processing, networking, and protocol handling.
3. Industrial Automation – Motor control, sensor interfacing.
4. Consumer Electronics – Image/video processing, smart devices.
5. Aerospace & Defense – Secure, high-reliability applications.
6. Automotive – ADAS, infotainment, and vehicle control.
Its reprogrammable nature makes it versatile for prototyping and low-to-mid volume production.
1. Embedded Systems – For custom logic and control.
2. Communications – Signal processing, networking, and protocol handling.
3. Industrial Automation – Motor control, sensor interfacing.
4. Consumer Electronics – Image/video processing, smart devices.
5. Aerospace & Defense – Secure, high-reliability applications.
6. Automotive – ADAS, infotainment, and vehicle control.
Its reprogrammable nature makes it versatile for prototyping and low-to-mid volume production.
Package
The EF2L45BG256B is an FPGA from Efinix, part of their Trion series. It features 45K logic elements and comes in a 256-ball BGA (Ball Grid Array) package. This package type is surface-mounted, offering high-density connections suitable for compact and high-performance applications. The "B" suffix typically indicates industrial-grade temperature range.
