EP1C20F400I7

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EP1C20F400I7

+BOM

IC FPGA 301 I/O 400FBGA

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Specifications

Attribute Value
Supplier Intel
Package / Case Tray
Series Cyclone®
Part Status Obsolete
Number of LABs/CLBs 2006
Number of Logic Elements/Cells 20060
Total RAM Bits 294912
Number of I/O 301
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)

Overview

Description

EP1C20F400I7 is an Altera/Intel Cyclone I FPGA device. It targets mid-range, cost-sensitive designs with moderate logic density.
Key points:
- Density: about 20k logic elements (LEs) in a 400-pin FineLine BGA package (F400).
- Suffix meaning: “I7” indicates industrial temperature range and speed grade 7.
- Features: multiple I/O banks (LVTTL/3.3V-compatible), on-chip memory blocks, DSP/MULTIPLIER resources, and clock management (PLLs), plus standard configuration and JTAG support.
- Use cases: digital logic, state machines, glue logic, DSP pipelines, and other reconfigurable implementations where low cost and moderate density are important.
Note: exact counts of RAM blocks, I/O, and compatible standards vary by package/revision. For precise specifications, consult the EP1C20F400I7 datasheet and user guide.

Pinout

- Pin count: 400 pins (FineLine BGA F400).
- Function: Altera Cyclone II FPGA device (EP1C20) offering programmable logic (~20K logic elements) and I/O for digital designs.

Manufacturer

The EP1C20F400I7 is manufactured by Altera Corporation, which is now part of Intel as Intel FPGA (formerly Intel’s Programmable Solutions Group). Altera is a semiconductor company that designs and sells programmable logic devices, notably CPLDs and FPGAs used to implement digital logic.

Application

EP1C20F400I7 is a low-cost Cyclone FPGA (about 20K logic elements, 400 I/O). Common application areas include:
- Embedded systems and microcontroller co-processing
- Custom I/O interfaces and peripheral controllers
- Glue logic and finite-state machines
- Small DSP and signal processing tasks
- Motion control, PWM and sensor interfacing
- Industrial automation, automotive and consumer electronics prototyping
- Education and rapid prototyping for digital design

Package

FineLine BGA package: 400-ball (F400) package.

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