Specifications
| Attribute | Value |
| Package / Case | Tray |
| Series | MAX® II |
| Part Status | Active |
| Programmable Type | In System Programmable |
| Delay Timetpd(1)Max | 7 ns |
| Voltage Supply - Internal | 2.5V, 3.3V |
| Number of Logic Elements/Blocks | 2210 |
| Number of Macrocells | 1700 |
| Number of I/O | 204 |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Mounting Type | Surface Mount |
Overview
Description
The EPM2210F256C3N is a member of Intel’s (formerly Altera) MAX® II CPLD family, offering non-volatile, instant-on programmable logic. Key features:
- 2,210 logic elements (LEs)
- 256-pin FineLine BGA package
- 3.3V core voltage (C3 speed grade)
- Embedded user flash memory (8,192 bits)
- Low power consumption
- Fast propagation delays (<5 ns)
Ideal for glue logic, interface bridging, and control applications, it combines FPGA-like density with CPLD simplicity. Supports JTAG and in-system programming (ISP).
For detailed specs, refer to Intel’s MAX II Device Handbook.
- 2,210 logic elements (LEs)
- 256-pin FineLine BGA package
- 3.3V core voltage (C3 speed grade)
- Embedded user flash memory (8,192 bits)
- Low power consumption
- Fast propagation delays (<5 ns)
Ideal for glue logic, interface bridging, and control applications, it combines FPGA-like density with CPLD simplicity. Supports JTAG and in-system programming (ISP).
For detailed specs, refer to Intel’s MAX II Device Handbook.
Equivalent
The EPM2210F256C3N is a MAX II CPLD from Intel (formerly Altera). Equivalent alternatives include:
1. Lattice LCMXO2-1200HC-6TG144C (MachXO2 series)
2. Xilinx XC2C256-7TQG144C (CoolRunner-II series)
3. Microchip ATF1508AS-15AU100 (ATF15xx series)
These offer similar logic density, I/O count, and package options. Check datasheets for exact compatibility.
1. Lattice LCMXO2-1200HC-6TG144C (MachXO2 series)
2. Xilinx XC2C256-7TQG144C (CoolRunner-II series)
3. Microchip ATF1508AS-15AU100 (ATF15xx series)
These offer similar logic density, I/O count, and package options. Check datasheets for exact compatibility.
Features
The EPM2210F256C3N is an Altera MAX II CPLD with these key features:
- Logic Elements (LEs): 2,210
- Macrocells: 1,700
- User I/O Pins: 216
- Memory: 8,192 Kbits (embedded UFM + RAM)
- Package: 256-pin FineLine BGA (FBGA)
- Operating Voltage: 3.3V (core) & 1.8V/2.5V/3.3V (I/O)
- Speed Grade: C3 (fastest in MAX II series)
- On-Chip Flash: Supports instant-on configuration
- JTAG & ISP: In-system programmability
- Operating Temp: Commercial (0°C to +85°C)
Ideal for high-density logic, bridging, and control applications.
- Logic Elements (LEs): 2,210
- Macrocells: 1,700
- User I/O Pins: 216
- Memory: 8,192 Kbits (embedded UFM + RAM)
- Package: 256-pin FineLine BGA (FBGA)
- Operating Voltage: 3.3V (core) & 1.8V/2.5V/3.3V (I/O)
- Speed Grade: C3 (fastest in MAX II series)
- On-Chip Flash: Supports instant-on configuration
- JTAG & ISP: In-system programmability
- Operating Temp: Commercial (0°C to +85°C)
Ideal for high-density logic, bridging, and control applications.
Pinout
The EPM2210F256C3N is an Altera (now Intel) MAX II CPLD with the following key specifications:
- Pin Count: 256 pins (FineLine BGA package).
- Core Logic Elements: 2,210 LEs.
- User I/O Pins: 160 (varies by configuration).
- On-Chip Flash Memory: 8,192 Kbits.
- Functions: Programmable logic for digital circuit design, supporting combinational and sequential logic, state machines, and glue logic.
- Speed Grade: C3 (medium speed performance).
It operates at 1.8V core voltage and supports JTAG programming. Commonly used in interface bridging, signal processing, and control applications.
- Pin Count: 256 pins (FineLine BGA package).
- Core Logic Elements: 2,210 LEs.
- User I/O Pins: 160 (varies by configuration).
- On-Chip Flash Memory: 8,192 Kbits.
- Functions: Programmable logic for digital circuit design, supporting combinational and sequential logic, state machines, and glue logic.
- Speed Grade: C3 (medium speed performance).
It operates at 1.8V core voltage and supports JTAG programming. Commonly used in interface bridging, signal processing, and control applications.
Package
The EPM2210F256C3N is an FPGA from Intel's MAX II family. It comes in a 256-pin FineLine BGA (FBGA) package. This surface-mount package offers high-density interconnects, suitable for compact designs. The "F256" in the part number indicates the 256-pin FBGA configuration. It operates at commercial temperature ranges (0°C to 85°C) and is RoHS-compliant.
