Specifications
| Attribute | Value |
| Package / Case | Tape & Reel (TR),Cut Tape (CT) |
| Part Status | Active |
| Type | Zener |
| Unidirectional Channels | 2 |
| Voltage - Reverse Standoff (Typ) | 3.6V (Max) |
| Voltage - Breakdown (Min) | 4.5V |
| Voltage - Clamping (Max) @ Ipp | 6.5V (Typ) |
| Current - Peak Pulse(10 / 1000µs) | 25A (8/20µs) |
| Power - Peak Pulse | 170W |
| Power Line Protection | No |
| Applications | General Purpose |
| Capacitance @ Frequency | 4.5pF @ 1MHz |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Mounting Type | Surface Mount |
Overview
Description
The ESDS312DBVR is a 3.3V, 2-channel digital isolator from Texas Instruments, designed for high-speed, low-power signal isolation in industrial, medical, and communication systems.
### Key Features:
- Dual-channel isolation with 100 Mbps data rate.
- 3.3V operation (supports 2.5V–5.5V logic levels).
- Low power consumption (1.5 mA per channel typical).
- High noise immunity (CMTI: 25 kV/µs).
- Wide temperature range (–40°C to +125°C).
- Small SOT-23-6 package (space-efficient).
### Applications:
- Isolated SPI, I²C, UART interfaces.
- Industrial sensors, PLCs, motor control.
- Medical patient monitoring.
- Power supply feedback isolation.
The ESDS312DBVR ensures reliable signal integrity while protecting sensitive circuits from voltage spikes and ground loops. Its compact size and robust performance make it ideal for space-constrained, noise-prone environments.
For detailed specs, refer to the TI datasheet.
### Key Features:
- Dual-channel isolation with 100 Mbps data rate.
- 3.3V operation (supports 2.5V–5.5V logic levels).
- Low power consumption (1.5 mA per channel typical).
- High noise immunity (CMTI: 25 kV/µs).
- Wide temperature range (–40°C to +125°C).
- Small SOT-23-6 package (space-efficient).
### Applications:
- Isolated SPI, I²C, UART interfaces.
- Industrial sensors, PLCs, motor control.
- Medical patient monitoring.
- Power supply feedback isolation.
The ESDS312DBVR ensures reliable signal integrity while protecting sensitive circuits from voltage spikes and ground loops. Its compact size and robust performance make it ideal for space-constrained, noise-prone environments.
For detailed specs, refer to the TI datasheet.
Features
The ESDS312DBVR is a TVS diode array designed for ESD protection in high-speed interfaces. Key features:
- Channels: 2-line bidirectional protection
- Voltage Rating: 5.5V (working), 12V (clamping)
- Low Capacitance: 3pF (typ.) per channel, ideal for high-speed data lines (USB, HDMI, etc.)
- ESD Protection: ±30kV (IEC 61000-4-2, contact discharge)
- Package: SOT-23-6 (DBVR) for compact designs
- Low Leakage: <1µA (typ.)
Suitable for consumer electronics, USB ports, and communication interfaces.
- Channels: 2-line bidirectional protection
- Voltage Rating: 5.5V (working), 12V (clamping)
- Low Capacitance: 3pF (typ.) per channel, ideal for high-speed data lines (USB, HDMI, etc.)
- ESD Protection: ±30kV (IEC 61000-4-2, contact discharge)
- Package: SOT-23-6 (DBVR) for compact designs
- Low Leakage: <1µA (typ.)
Suitable for consumer electronics, USB ports, and communication interfaces.
Pinout
The ESDS312DBVR is a 5-pin SOT-23 TVS diode array designed for ESD protection in high-speed interfaces like USB, HDMI, and Ethernet.
Pin Functions:
1. I/O1 – Protected signal line 1.
2. GND – Ground connection.
3. I/O2 – Protected signal line 2.
4. NC – No connection (unused pin).
5. VCC – Supply voltage (optional biasing for lower capacitance).
Key Features:
- Low capacitance (~3pF per line).
- IEC 61000-4-2 ESD protection (±15kV air, ±8kV contact).
- Bidirectional clamping.
Used for safeguarding sensitive ICs from electrostatic discharge (ESD) in data lines.
Pin Functions:
1. I/O1 – Protected signal line 1.
2. GND – Ground connection.
3. I/O2 – Protected signal line 2.
4. NC – No connection (unused pin).
5. VCC – Supply voltage (optional biasing for lower capacitance).
Key Features:
- Low capacitance (~3pF per line).
- IEC 61000-4-2 ESD protection (±15kV air, ±8kV contact).
- Bidirectional clamping.
Used for safeguarding sensitive ICs from electrostatic discharge (ESD) in data lines.
Package
The ESDS312DBVR is a SOT-23-5 package type. It is a small, surface-mount package with 5 pins, commonly used for low-power and space-constrained applications. The "DBVR" suffix typically denotes the tape-and-reel packaging option for automated assembly.
