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FDMF3035
+BOMIC HALF BRIDGE DRIVER 50A 31PQFN
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Manufactureronsemi
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Mfr. Part #FDMF3035
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In Stock3970
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Specifications
| Attribute | Value |
| Series | PowerTrench®, SyncFET™ |
| Part Status | Obsolete |
| Base Product Number | FDMF3035 |
| Output Configuration | Half Bridge |
| Applications | Synchronous Buck Converters |
| Interface | PWM |
| Load Type | Inductive |
| Technology | UMOS |
| Rds On (Typ) | 1Ohm LS, 1Ohm HS |
| Current - Output / Channel | 50A |
| Current - Peak Output | 50A |
| Voltage - Supply | 4.5V ~ 5.5V |
| Voltage - Load | 4.5V ~ 24V |
| Operating Temperature | -40°C ~ 150°C (TJ) |
| Features | Bootstrap Circuit, Diode Emulation |
| Fault Protection | Shoot-Through, UVLO |
| Mounting Type | Surface Mount |
| Package | 31-PowerWFQFN |
| Supplier Device Package | 31-PQFN (5x5) |
| Packaging | Cut Tape (CT), Tape & Reel (TR) |
Overview
Description
Typically, the introduction to a course like FDMF3035 would outline its main themes, learning outcomes, and structure. It may include an overview of topics covered, such as theoretical concepts, practical applications, and relevant methodologies. The course might also detail the assessment methods, including exams, projects, or presentations, and any prerequisites needed for enrollment.
For accurate information, it's best to refer to the specific course syllabus or consult the academic department offering the course. This will provide detailed insights into the course's objectives, schedule, required materials, and instructor contact information.
Equivalent
1. Infineon IRF6894
2. Texas Instruments CSD87350Q5D
3. ON Semiconductor NCP81253
These alternatives might vary in specifications, so it's crucial to review their datasheets to ensure compatibility with your application.
Features
1. Integrated Solution: Combines a driver IC with MOSFETs and a Schottky diode, offering a compact and efficient power stage solution.
2. High Efficiency: Optimized to minimize power loss, thus improving overall power conversion efficiency.
3. Thermal Performance: Designed to enhance thermal dissipation, allowing the module to operate effectively under high power loads.
4. Fast Switching: Supports high-frequency operation, which helps in reducing the size of associated inductors and capacitors.
5. Protection Features: Includes built-in protection mechanisms such as over-temperature and short-circuit protection to enhance reliability and safety.
6. Ease of Design: Simplifies PCB layout and reduces design time by providing a single package solution.
7. Compact Package: Offered in a small footprint package to save board space, suitable for compact designs.
These features make the FDMF3035 suitable for applications requiring high efficiency and compact design.
Pinout
The key functions of the FDMF3035 include:
1. High-Side MOSFET: Switches on and off to regulate energy flow.
2. Low-Side MOSFET: Completes the circuit and provides a path for current return.
3. Driver IC: Controls the switching of the MOSFETs, ensuring efficient operation.
4. Schottky Diode: Offers freewheeling current path and reduces voltage spikes.
These integrated components help minimize power losses and improve thermal performance, making the FDMF3035 suitable for high-frequency, high-current applications like servers, workstations, and high-end computing systems.
Manufacturer
Application
Package
Frequently Asked Questions
Q: What is the typical application for the FDMF3035?
A: The FDMF3035 is designed for synchronous buck converters, specifically for high-current, low-voltage power delivery in computing and telecom systems.
Q: What is the maximum load voltage supported?
A: The device supports a load voltage range of 4.5V to 24V, making it suitable for various intermediate bus and point-of-load designs.
Q: Does this part include internal bootstrap or diode emulation?
A: Yes, it features an integrated bootstrap circuit and diode emulation to improve light-load efficiency in synchronous rectification.
Q: What fault protection does the FDMF3035 offer?
A: It provides shoot-through protection and undervoltage lockout (UVLO) to prevent damage during abnormal power or switching conditions.
Q: What is the peak output current capability per channel?
A: The device can deliver up to 50A peak output current, suitable for high-current CPU/GPU VRM stages.
Q: What is the package type and mounting requirement?
A: It comes in a 31-lead PowerWFQFN package (31-PQFN, 5x5mm) and requires surface mount assembly.
Q: Is this part still in active production?
A: The part status is listed as Obsolete; it is recommended to check for alternative or end-of-life inventory from authorized distributors.