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GD25LE64CLIGR
+BOMIC FLASH 64MBIT SPI/QUAD 21WLCSP
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ManufacturerGigaDevice Semiconductor (HK) Limited
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Mfr. Part #GD25LE64CLIGR
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Package 21-XFBGA, WLSCP
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In Stock2679
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Specifications
| Attribute | Value |
| Package | Tape & Reel (TR) |
| ProductStatus | Active |
| MemoryType | Non-Volatile |
| MemoryFormat | FLASH |
| Technology | FLASH - NOR |
| MemorySize | 64Mb (8M x 8) |
| MemoryInterface | SPI - Quad I/O |
| ClockFrequency | 133 MHz |
| WriteCycleTime-WordPage | 2.4ms |
| Voltage-Supply | 1.65V ~ 2V |
| OperatingTemperature | -40°C ~ 85°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 21-XFBGA, WLSCP |
Overview
Description
Key features of the GD25LE64CLIGR include a wide voltage range for operation (typically around 2.7V to 3.6V), fast read and write speeds, and support for Dual and Quad SPI modes, which enhance data transfer rates. It also provides features like block protection, security registers, and efficient power-down capabilities, making it suitable for applications ranging from consumer electronics to industrial systems. Its compact design and reliability make it ideal for space-sensitive applications and devices requiring robust memory solutions.
Equivalent
1. Winbond W25Q64JV - a 64Mb serial Flash memory.
2. Macronix MX25L6406E - a 64Mb SPI Flash memory.
3. Micron N25Q064A - a 64Mb serial NOR Flash.
4. ISSI IS25LQ064 - a 64Mb serial Flash.
Ensure to verify compatibility with your specific requirements, such as voltage, package type, and operating temperature.
Features
1. Capacity: 64 Mbit (8 MB).
2. Interface: SPI-compatible, supporting Standard/Dual/Quad I/O.
3. Performance: Fast read performance with a maximum clock frequency of up to 133 MHz.
4. Voltage Range: Operates with a wide voltage range from 1.7V to 2.0V.
5. Endurance: High durability with 100,000 Program/Erase cycles per sector.
6. Data Retention: Data retention of 20 years.
7. Security: Includes security features like write protection and software-protected data.
8. Package: Available in different packages, such as SOP8, USON8, and WSON8 for flexibility in design.
9. Temperature Range: Supports industrial temperature ranges.
10. Low Power Consumption: Energy-efficient design ideal for battery-operated devices.
These features make the GD25LE64CLIGR suitable for a variety of applications, including consumer electronics, IoT devices, and automotive systems.
Pinout
Here is a brief overview of its pin functions:
1. CS# (Chip Select): Activates the device when pulled low.
2. SO (Serial Output): Transfers data from the chip to the controller.
3. WP# (Write Protect): When low, certain write operations are disabled, protecting parts of the memory.
4. VSS (Ground): Ground reference for the chip.
5. SI (Serial Input): Transfers data from the controller to the chip.
6. SCK (Serial Clock): Provides the clock signal for data transfers.
7. HOLD#: Pauses serial communication without deselecting the device.
8. VCC (Power Supply): Provides power to the chip.
These pins support the SPI (Serial Peripheral Interface) protocol, facilitating serial communication with microcontrollers and other interfaces.
Manufacturer
Application
1. Consumer Electronics: Used in devices like smart TVs, set-top boxes, and gaming consoles for firmware storage.
2. IoT Devices: Provides storage for firmware updates and data logging in smart home devices and wearables.
3. Industrial Systems: Employed in control systems and instrumentation for secure data storage.
4. Networking Equipment: Utilized in routers and switches for configuration and firmware management.
5. Automotive Systems: Stores configuration data and software for infotainment and navigation systems.
This chip is versatile due to its high-density storage and fast read/write capabilities.