Specifications
| Attribute | Value |
| Supplier | STMicroelectronics |
| Package | Tray |
| ProductStatus | Active |
| Type | Digital |
| Axis | X, Y, Z |
| AccelerationRange | ±100g |
| Sensitivity(LSB/g) | 1 |
| Bandwidth | 25Hz ~ 200Hz |
| OutputType | I²C, SPI |
| Voltage-Supply | 2.16V ~ 3.6V |
| Features | Sleep Mode |
| OperatingTemperature | -40°C ~ 85°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 16-VFLGA |
Overview
Description
Introduction to H3LIS100DL:
- What it is: A 3-axis linear Hall-effect sensor from Honeywell (H3LIS family) that senses magnetic flux along X, Y, and Z and outputs corresponding voltages.
- Outputs: Three proportional analog outputs (one for each axis), suitable for direct read by MCU ADCs and typically ratiometric to the supply.
- Key uses: Non-contact position sensing, magnetic encoders, motor commutation, orientation/compass, and proximity sensing.
- Benefits: Small package, low power, good temperature stability, and no moving parts.
- How to use: Mount the sensor near a magnet, power from a single supply, and read the X/Y/Z outputs with an MCU; apply calibration to compensate offset and cross-axis effects.
- Variant note: DL denotes a specific package/interface variant; check the datasheet for exact pinout, supply range, sensitivity, and output characteristics.
- For detailed specs: Refer to the Honeywell H3LIS100DL datasheet and application notes.
- What it is: A 3-axis linear Hall-effect sensor from Honeywell (H3LIS family) that senses magnetic flux along X, Y, and Z and outputs corresponding voltages.
- Outputs: Three proportional analog outputs (one for each axis), suitable for direct read by MCU ADCs and typically ratiometric to the supply.
- Key uses: Non-contact position sensing, magnetic encoders, motor commutation, orientation/compass, and proximity sensing.
- Benefits: Small package, low power, good temperature stability, and no moving parts.
- How to use: Mount the sensor near a magnet, power from a single supply, and read the X/Y/Z outputs with an MCU; apply calibration to compensate offset and cross-axis effects.
- Variant note: DL denotes a specific package/interface variant; check the datasheet for exact pinout, supply range, sensitivity, and output characteristics.
- For detailed specs: Refer to the Honeywell H3LIS100DL datasheet and application notes.
Pinout
- Pin count: 16 pins (LGA-16 package).
- Function: 3‑axis MEMS accelerometer with digital output. Provides X/Y/Z acceleration data with a digital interface (I2C or SPI); includes power, ground, interrupt/control pins and serial data/clock lines.
- Function: 3‑axis MEMS accelerometer with digital output. Provides X/Y/Z acceleration data with a digital interface (I2C or SPI); includes power, ground, interrupt/control pins and serial data/clock lines.
Manufacturer
- Manufacturer: Honeywell (Honeywell Sensing and Control)
- What kind of company: An American multinational conglomerate that designs and manufactures a broad range of technologies and products, including sensors, aerospace systems, building technologies, and safety/productivity solutions.
- What kind of company: An American multinational conglomerate that designs and manufactures a broad range of technologies and products, including sensors, aerospace systems, building technologies, and safety/productivity solutions.
Application
Common application areas for the H3LIS100DL (3-axis high-g digital accelerometer):
- Automotive safety: airbag/seatbelt deployments, rollover and crash detection.
- Consumer electronics: impact/shock detection in rugged handhelds, orientation sensing.
- Industrial/automation: machine-shock/vibration monitoring, predictive maintenance, packaging-drop sensing.
- Drones & robotics: high-g inertial sensing for control during rough landings and crashes.
- Sports and wearables: measuring high-dynamic impacts and motions.
- Automotive safety: airbag/seatbelt deployments, rollover and crash detection.
- Consumer electronics: impact/shock detection in rugged handhelds, orientation sensing.
- Industrial/automation: machine-shock/vibration monitoring, predictive maintenance, packaging-drop sensing.
- Drones & robotics: high-g inertial sensing for control during rough landings and crashes.
- Sports and wearables: measuring high-dynamic impacts and motions.
Package
Surface-mount (SMD) package. H3LIS100DL uses an 8-pin leadless/LGA‑style package (no through-hole).
