Images are for reference only
ISP752R
+BOM-
ManufacturerInfineon Technologies
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Mfr. Part #ISP752R
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In Stock2188
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Specifications
| Attribute | Value |
| Product | Power Switches |
| Packaging | Reel |
| Brand | Infineon Technologies |
| Maximum Operating Temperature | + 85 C |
| Minimum Operating Temperature | - 30 C |
| Product Type | Power Switch ICs - Power Distribution |
| Series | Industrial PROFET |
| Factory Pack Quantity | 2500 |
| Subcategory | Switch ICs |
| Mounting Type | SMD/SMT |
| Unit Weight | 0.002928 oz |
| Supply Voltage - Min | 6 V |
| Supply Voltage - Max | 52 V |
| Package / Case | SOIC-8 |
| Operating Supply Voltage | 6 V to 52 V |
| Part # Aliases | ISP752RXT SP000219825 ISP752RFUMA1 |
| Type | High Side |
| Tradename | PROFET |
| Moisture Sensitive | Yes |
| Number of Outputs | 1 Output |
| Current - Output | 1.3 A |
| Current Limit | 6.5 A |
| On Resistance - Max | 200 mOhms |
| On Time - Max | 180 us |
| Off Time - Max | 200 us |
| Pd - Power Dissipation | 1.5 W |
Overview
Description
Key features of ISP752R include its ability to process large amounts of data with minimal latency, integrated memory management, and support for various input/output interfaces. This flexibility allows developers to implement complex algorithms and enhance system functionalities without compromising performance.
The ISP752R is part of a broader trend towards increasing integration in electronic components, aimed at reducing component count and improving reliability in modern electronic designs. Its applications range from consumer electronics to industrial automation, contributing to the advancement of high-speed communication technologies and smart devices.
Equivalent
Features
1. Architecture: It utilizes a scalable and flexible architecture that supports various data formats and processing requirements.
2. Processing Speed: Offers high processing speeds, enabling real-time performance for complex algorithms.
3. Multi-Core Design: Supports multi-core configurations for enhanced parallel processing capabilities.
4. Memory Interface: Includes advanced memory management with high-bandwidth interfaces to handle large data sets efficiently.
5. Low Power Consumption: Designed for energy efficiency, making it suitable for portable and battery-powered devices.
6. Integration: Features integrated peripherals, such as ADCs and DACs, reducing the need for external components.
7. Development Support: Compatible with various development environments and tools, facilitating easier integration and deployment.
Overall, the ISP752R is ideal for applications requiring robust processing capabilities, low latency, and efficient power management.
Pinout
1. A (Pin 1): Non-inverting output for differential signal.
2. B (Pin 2): Inverting output for differential signal.
3. RO (Pin 3): Receiver output; provides the received data.
4. RE (Pin 4): Receiver enable; active low to enable the receiver.
5. DE (Pin 5): Driver enable; active high to enable the driver.
6. DI (Pin 6): Driver input; receives data to be transmitted.
7. GND (Pin 7): Ground reference.
8. VCC (Pin 8): Supply voltage input.
The ISP752R supports half-duplex communication and is suitable for multi-point connections in noisy environments.