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JS28F320J3F75A
+BOMIC FLASH 32MBIT PARALLEL 56TSOP
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ManufacturerMicron Technology Inc.
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Mfr. Part #JS28F320J3F75A
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Datasheet JS28F320J3F75A DataSheet
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In Stock3326
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Specifications
| Attribute | Value |
| Series | StrataFlash™ |
| Part Status | Obsolete |
| Base Product Number | JS28F320J3 |
| DigiKey Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NOR |
| Memory Size | 32Mbit |
| Memory Organization | 4M x 8, 2M x 16 |
| Memory Interface | Parallel |
| Write Cycle Time - Word, Page | 75ns |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package | 56-TFSOP (0.724", 18.40mm Width) |
| Supplier Device Package | 56-TSOP |
| Packaging | Tray |
| Access Time | 75 ns |
Overview
Description
Key features of the JS28F320J3F75A include high-performance read and write operations, enhanced reliability, and low power consumption, making it suitable for embedded systems and consumer electronics. It operates at a voltage range that supports efficient energy usage, which is crucial for battery-powered devices. The memory is organized in a Uniform Block Architecture, allowing for efficient data management and access.
Additionally, it supports advanced security features and provides fast access times, which are essential for applications needing quick data retrieval. Its compact design and robust architecture make it a popular choice in applications where space is a constraint but reliable data storage is necessary. The JS28F320J3F75A, like others in the StrataFlash series, integrates well with various microcontrollers and processors, enhancing its versatility across numerous technological platforms.
Equivalent
- Micron: MT28F320J3
- Spansion (now part of Cypress Semiconductor): S29GL032N
- Winbond: W29GL032C
Ensure to verify package compatibility and electrical characteristics when considering equivalent replacements.
Features
1. Memory Capacity: 32 Megabits organized as 4 Megabytes (4M x 8) or 2 Megabytes (2M x 16).
2. Architecture: Intel’s advanced flash memory with multilevel cell (MLC) technology, enabling higher density.
3. Voltage Range: Operates on a 2.7V to 3.6V power supply, making it suitable for low-power applications.
4. Performance: Fast read access times of 75 nanoseconds, suitable for high-speed operations.
5. Interface: Supports standard flash memory interfaces, allowing for ease of integration.
6. Endurance and Reliability: Provides high endurance with 100,000 write/erase cycles per block, ensuring longevity.
7. Data Protection: Equipped with features like hardware and software data protection to prevent accidental writes or erases.
8. Package Type: Available in various package types, such as TSOP and BGA, to accommodate different design requirements.
9. Applications: Commonly used in embedded systems, consumer electronics, and mobile devices for reliable data storage.
These features make it a versatile choice for applications requiring reliable and efficient non-volatile memory storage.
Pinout
1. 64-ball FBGA package: This version has 64 pins.
2. 56-lead TSOP package: This version has 56 pins.
The primary functions of the pins include:
- Address Pins (A0-A20): Used to specify the memory address for read/write operations.
- Data Pins (DQ0-DQ15): Used for data input/output.
- Control Pins:
- CE# (Chip Enable): Activates the memory device.
- OE# (Output Enable): Enables data output.
- WE# (Write Enable): Controls write operations.
- WP# (Write Protect): Protects sector from being written.
- RST# (Reset): Resets the device.
- VCC and VSS: Power supply and ground connections, respectively.
- RY/BY# (Ready/Busy): Indicates the status of the memory (whether it is busy with internal operations).
This configuration facilitates both read and write operations essential for embedded systems.
Manufacturer
Application
1. Consumer Electronics: Utilized in devices like digital cameras, smartphones, and MP3 players for firmware storage.
2. Industrial Automation: Used in control systems and programmable logic controllers (PLCs) for reliable data storage.
3. Automotive: Employed in infotainment systems, navigation units, and electronic control units (ECUs) for code storage.
4. Networking Equipment: Helps in storing firmware for routers, switches, and other network devices.
5. Medical Devices: Used in diagnostic and monitoring equipment for secure software storage.
Its non-volatile nature ensures data retention during power loss, making it suitable for applications requiring reliable, long-term storage.
Package
Frequently Asked Questions
Q: What is the memory size and organization of the JS28F320J3F75A?
A: It offers 32Mbit (32 Megabit) capacity, organized as 4M x 8 or 2M x 16, allowing flexible data bus width selection.
Q: Is this component suitable for industrial temperature ranges?
A: Yes, its operating temperature range is -40°C to 85°C (TA), making it ideal for industrial environments.
Q: What is the access time of this FLASH memory?
A: The access time is 75 ns, with a write cycle time of 75 ns per word or page, ensuring fast read and write operations.
Q: What is the supply voltage requirement?
A: It requires a supply voltage of 2.7V to 3.6V, making it compatible with standard 3.3V logic systems.
Q: What package type does this device come in?
A: It is supplied in a 56-TFSOP (0.724", 18.40mm Width) surface-mount package, with a supplier device package of 56-TSOP.
Q: What is the memory interface of the JS28F320J3F75A?
A: It uses a Parallel memory interface, suitable for direct connection to microcontrollers or processors with parallel bus support.
Q: Is the JS28F320J3F75A still in active production?
A: No, its part status is listed as "Obsolete"; consider verifying availability or evaluating replacement parts for new designs.
