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LPC18S30FET256E
+BOMIC MCU 32BIT ROMLESS 256LBGA
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ManufacturerNXP USA Inc.
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Mfr. Part #LPC18S30FET256E
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Datasheet LPC18S30FET256E DataSheet
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Package LBGA-256
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In Stock2321
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Specifications
| Attribute | Value |
| Supplier | NXP USA Inc. |
| Package / Case | Tray |
| Series | LPC18xx |
| Part Status | Active |
| Core Processor | ARM® Cortex®-M3 |
| Core Size | 32-Bit Single-Core |
| Speed | 180MHz |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB |
| Peripherals | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT |
| Number of I/O | 164 |
| Program Memory Type | ROMless |
| RAM Size | 200K x 8 |
| Voltage - Supply (Vcc/Vdd) | 2.2V ~ 3.6V |
| Data Converters | A/D 8x10b; D/A 1x10b |
| Oscillator Type | Internal |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
