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MBRAF3200T3G
+BOMDIODE SCHOTTKY 200V 3A SMA-FL
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Manufactureronsemi
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Mfr. Part #MBRAF3200T3G
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Datasheet MBRAF3200T3G DataSheet
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Package DO-221AC, SMA Flat Leads
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In Stock27191
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Specifications
| Attribute | Value |
| Supplier | onsemi |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| ProductStatus | Active |
| DiodeType | Schottky |
| Voltage-DCReverse(Vr)(Max) | 200 V |
| Current-AverageRectified(Io) | 3A |
| Voltage-Forward(Vf)(Max)@If | 840 mV @ 3 A |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) |
| Current-ReverseLeakage@Vr | 1 mA @ 200 V |
| MountingType | Surface Mount |
| Package/Case | DO-221AC, SMA Flat Leads |
| SupplierDevicePackage | SMA-FL |
Overview
Description
For a concise introduction, identification of the manufacturer or supplier would be necessary, as they would provide data sheets or technical documents detailing the component’s features, application guidelines, and performance parameters. If you are considering using this component in a project, consult these resources or contact the manufacturer directly to gain a thorough understanding of its capabilities and ensure it meets your application’s requirements.
Equivalent
1. STMicroelectronics STPS30L60CT
2. Vishay V30100C
3. ON Semiconductor MBRS340T3G
4. Diodes Incorporated SBR30A60CT
5. Nexperia PMEG3050EP
Ensure compatibility by checking datasheets for electrical characteristics, package type, and thermal ratings.
Features
1. High Efficiency: SiC technology offers lower forward voltage drop, reducing power loss and enhancing efficiency.
2. High-Speed Switching: The diode supports fast recovery times, making it suitable for high-frequency applications.
3. High-Temperature Operation: It can operate at higher junction temperatures compared to silicon-based diodes, improving reliability in demanding environments.
4. Low Reverse Leakage Current: Ensures minimal energy loss during reverse recovery.
5. Robust Construction: It is designed for greater thermal stability and mechanical robustness.
6. Compact Package: Available in a TO-247 package, facilitating easy integration into existing systems.
7. Wide Bandgap: The SiC material provides a wide bandgap, contributing to its ability to handle higher voltages and temperatures.
These features make the MBRAF3200T3G suitable for applications like power supplies, motor drives, and renewable energy systems.
Pinout
The MBRAF3200T3G typically comes in a DPAK (TO-252) package, which is a common surface-mount package for power semiconductors. The DPAK package generally has three pins:
1. Anode (Pin 1): This is the positive terminal where the current enters the diode.
2. Cathode (Pin 2): This is the negative terminal where the current exits the diode. In some datasheets, the cathode might be internally connected to the thermal pad, which is often labeled as pin 3 or the tab.
3. Tab (Pin 3): The tab is generally connected to the cathode and is used for heat dissipation.
The primary function of the MBRAF3200T3G is to allow current to pass in one direction while blocking it in the opposite direction, thus performing rectification in power applications.