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MCF54453VR266
+BOMIC MCU 32BIT ROMLESS 360TEPBGA
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ManufacturerNXP USA Inc.
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Mfr. Part #MCF54453VR266
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Datasheet MCF54453VR266 DataSheet
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Package BBGA-360
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In Stock909
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Specifications
| Attribute | Value |
| Supplier | Flip Electronics,NXP USA Inc. |
| Package | Bulk,Tray |
| Series | MCF5445x |
| ProductStatus | Obsolete |
| CoreProcessor | Coldfire V4 |
| CoreSize | 32-Bit Single-Core |
| Speed | 266MHz |
| Connectivity | I²C, SPI, SSI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| NumberofI/O | 132 |
| ProgramMemoryType | ROMless |
| RAMSize | 32K x 8 |
| Voltage-Supply(Vcc/Vdd) | 1.35V ~ 3.6V |
| OscillatorType | Internal |
| OperatingTemperature | 0°C ~ 70°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 360-BBGA |
