Specifications
| Attribute | Value |
| Supplier | NXP USA Inc. |
| Package / Case | Tray |
| Series | i.MX6D |
| Part Status | Active |
| Core Processor | ARM® Cortex®-A9 |
| Number of Cores / Bus Width | 2 Core, 32-Bit |
| Speed | 800MHz |
| Co - Processors / DSP | Multimedia; NEON™ SIMD |
| RAM Controllers | LPDDR2, LVDDR3, DDR3 |
| Graphics Acceleration | Yes |
| Display&Interface Controllers | Keypad, LCD |
| Ethernet | 10/100/1000Mbps (1) |
| SATA | SATA 3Gbps (1) |
| USB | USB 2.0 + PHY (4) |
| Voltage - I / O | 1.8V, 2.5V, 2.8V, 3.3V |
| Operating Temperature | -40°C ~ 105°C (TA) |
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
Overview
Description
MCIMX6D7CVT08AE is a NXP i.MX 6-series computer-on-module (COM) built around the i.MX 6D7 SoC. It’s designed to be plugged into a host carrier board for embedded applications.
Key points:
- CPU: ARM Cortex-A9 cores (dual/quad, up to ≈1 GHz), with integrated multimedia hardware.
- Memory/Storage: options for DDR3/LPDDR2 and storage such as eMMC or SD card.
- I/O: broad I/O set including USB, Ethernet, HDMI/Display interfaces, PCIe, CAN, UARTs, I2C, SPI, etc.; supports camera/display interfaces (CSI/DSI) on many variants.
- Software: supports Linux and Android (Yocto/OpenEmbedded workflows commonly used).
- Applications: industrial automation, HMI, digital signage, medical devices, and edge computing.
- Notes: exact RAM/flash sizes, temperature range, and carrier compatibility vary by configuration; consult the vendor’s datasheet for MCIMX6D7CVT08AE for precise specs.
If you need, share your target requirements (I/O, temp range, OS) and I can map them to this module’s options.
Key points:
- CPU: ARM Cortex-A9 cores (dual/quad, up to ≈1 GHz), with integrated multimedia hardware.
- Memory/Storage: options for DDR3/LPDDR2 and storage such as eMMC or SD card.
- I/O: broad I/O set including USB, Ethernet, HDMI/Display interfaces, PCIe, CAN, UARTs, I2C, SPI, etc.; supports camera/display interfaces (CSI/DSI) on many variants.
- Software: supports Linux and Android (Yocto/OpenEmbedded workflows commonly used).
- Applications: industrial automation, HMI, digital signage, medical devices, and edge computing.
- Notes: exact RAM/flash sizes, temperature range, and carrier compatibility vary by configuration; consult the vendor’s datasheet for MCIMX6D7CVT08AE for precise specs.
If you need, share your target requirements (I/O, temp range, OS) and I can map them to this module’s options.
Equivalent
MCIMX6D7CVT08AE is an NXP i.MX 6 series module (likely i.MX 6D Dual). Direct equivalents are other i.MX6D/6Q-based modules from vendors such as Variscite, Boundary Devices, iWave, TechNexion with similar RAM/flash and peripherals. For an exact cross-reference, please share the datasheet or target requirements (CPU speed, RAM, interfaces).
Features
Here are typical features of the MCIMX6D7CVT08AE (NXP i.MX 6D/7 based module). Exact spec details should be confirmed in the datasheet for this revision.
- CPU: ARM Cortex-A9 cores (dual/quad variant) up to about 1 GHz; NEON/VFPv3
- Graphics/Media: Vivante 2D/3D accelerator; hardware video decode/encode (e.g., H.264/MPEG4/VC-1)
- Memory/Storage: DDR3/LPDDR2 support; on-board storage options (eMMC/NAND); microSD
- Connectivity: Gigabit Ethernet; USB 2.0 host and OTG
- Expansion: PCIe 2.0 (x1); multiple UARTs; I2C; SPI; PWM
- Display/Camera: HDMI; LVDS/parallel LCD; MIPI-CSI; MIPI-DSI
- Audio: I2S/Audio interfaces
- Power/PM: PMIC-based power management; watchdog; RTC
- Operating range: Industrial-grade temperature (-40 to 85°C); wide input power (typ. 5V)
- Software: Linux/Android support; available BSPs
Note: exact features and available interfaces depend on the specific revision of MCIMX6D7CVT08AE—consult the official datasheet for precise details.
- CPU: ARM Cortex-A9 cores (dual/quad variant) up to about 1 GHz; NEON/VFPv3
- Graphics/Media: Vivante 2D/3D accelerator; hardware video decode/encode (e.g., H.264/MPEG4/VC-1)
- Memory/Storage: DDR3/LPDDR2 support; on-board storage options (eMMC/NAND); microSD
- Connectivity: Gigabit Ethernet; USB 2.0 host and OTG
- Expansion: PCIe 2.0 (x1); multiple UARTs; I2C; SPI; PWM
- Display/Camera: HDMI; LVDS/parallel LCD; MIPI-CSI; MIPI-DSI
- Audio: I2S/Audio interfaces
- Power/PM: PMIC-based power management; watchdog; RTC
- Operating range: Industrial-grade temperature (-40 to 85°C); wide input power (typ. 5V)
- Software: Linux/Android support; available BSPs
Note: exact features and available interfaces depend on the specific revision of MCIMX6D7CVT08AE—consult the official datasheet for precise details.
Manufacturer
Manufacturer: TechNexion (Taiwan-based embedded hardware company).
What kind of company: TechNexion designs and manufactures embedded computing solutions, including computer-on-modules (CoMs), SBCs and related accessories for industrial applications.
What kind of company: TechNexion designs and manufactures embedded computing solutions, including computer-on-modules (CoMs), SBCs and related accessories for industrial applications.
Application
MCIMX6D7CVT08AE is a development module based on the i.MX6 Dual/Quad ARM Cortex-A9. Suitable application areas include:
- Automotive: infotainment, instrument clusters, telematics
- Industrial: automation, HMI, rugged controllers
- Digital signage and kiosks
- Medical displays and monitoring devices
- Consumer multimedia: set-top boxes, media players, smart TVs
- Security/Surveillance: IP cameras, edge devices
- Networking and IoT gateways
- Robotics and smart appliances
- Embedded control panels and rugged embedded systems
- Automotive: infotainment, instrument clusters, telematics
- Industrial: automation, HMI, rugged controllers
- Digital signage and kiosks
- Medical displays and monitoring devices
- Consumer multimedia: set-top boxes, media players, smart TVs
- Security/Surveillance: IP cameras, edge devices
- Networking and IoT gateways
- Robotics and smart appliances
- Embedded control panels and rugged embedded systems
Package
Package type: BGA (FBGA) package; exact ball count depends on the specific variant.
