MPXM2010GS

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MPXM2010GS

+BOM

SENS PRESSURE 1.45 PSI MAX MPAK

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Specifications

Attribute Value
Package / Case Tube
Series MPX2010
Part Status Active
Applications Board Mount
Pressure Type Vented Gauge
Operating Pressure 1.45PSI (10kPa)
Output Type Wheatstone Bridge
Output 0 mV ~ 25 mV (10V)
Accuracy ±1%
Voltage - Supply 10V ~ 16V
Port Size Male - 0.12 (2.97mm) Tube
Port Style Barbless
Features Temperature Compensated
Termination Style Gull Wing
Maximum Pressure 10.88PSI (75kPa)
Operating Temperature -40°C ~ 125°C

Overview

Description

"Introduction to MPXM2010GS" likely refers to a foundational overview of a specific course or program code. While the exact content can vary depending on the context, generally, an introduction to a course like MPXM2010GS would outline the key objectives, scope, content areas, and learning outcomes. It may cover topics such as management principles, strategic approaches in global settings, or technology applications in modern business environments. The introduction typically sets the stage by explaining how the course fits into a broader academic or professional curriculum, what skills students are expected to develop, and how these skills apply in real-world scenarios. Additionally, it might provide details about assessment methods, course materials, and any prerequisites required. For precise details, it would be best to consult the course syllabus or official program documentation from the institution offering it.

Equivalent

The MPXM2010GS is a pressure sensor designed by NXP/Freescale. Equivalent products would include similar pressure sensors from other manufacturers with comparable specifications. Some alternatives are:
1. Honeywell's ABP Series (e.g., ABPDANT001BG2A3).
2. TE Connectivity's M3200 Series.
3. Bosch's BMP280.
Ensure compatibility by checking specifications like pressure range, calibration, and package type.

Features

The MPXM2010GS is a pressure sensor designed for precision measurement in a range of applications. Key features include:
1. Pressure Range: It typically measures pressures from 0 to 10 kPa (0 to 1.45 psi).

2. Output Type: The sensor provides an analog voltage output, which is proportional to the applied pressure.

3. Accuracy: It offers high accuracy and repeatability with minimal error over its operating range.

4. Temperature Compensation: The sensor includes on-chip temperature compensation, ensuring consistent performance across a specified temperature range.

5. Package Type: The MPXM2010GS comes in a small, surface-mount package, making it suitable for compact designs.

6. Supply Voltage: It typically operates with a supply voltage of around 5V.

7. Application Areas: Common applications include medical devices, consumer electronics, and automotive systems where precise pressure measurements are crucial.
These features make the MPXM2010GS suitable for low-pressure applications that require reliable and accurate pressure sensing solutions.

Manufacturer

The MPXM2010GS is manufactured by NXP Semiconductors. NXP is a global semiconductor company that specializes in providing solutions for secure connectivity and infrastructure for the automotive, industrial, mobile, and smart home industries. They are known for producing a wide range of semiconductor devices, including microcontrollers, processors, sensors, and RF components. NXP's products are integral to many applications requiring advanced security, connectivity, and processing power.

Application

The MPXM2010GS is a pressure sensor commonly used in various applications, including automotive systems for monitoring engine oil, fuel pressure, and manifold air pressure. It is also employed in industrial systems for measuring hydraulic and pneumatic pressures. Additionally, the sensor finds usage in consumer electronics for barometric pressure measurement and in HVAC systems for monitoring airflow and pressure. Its integration capability with microcontrollers makes it suitable for embedded systems where precise pressure measurement is needed.

Package

The MPXM2010GS is packaged in a Surface Mount Device (SMD) configuration, specifically using a Small Outline Package (SOP). This type of packaging is designed for mounting directly onto the surface of printed circuit boards (PCBs), offering a compact and efficient form factor for electronic components.