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MT41K256M16HA-125IT:E
+BOM1.283V~1.45V 4Gbit 800MHz DDR3L SDRAM BGA Memory (ICs) RoHS
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ManufacturerMicron
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Mfr. Part #MT41K256M16HA-125IT:E
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In Stock6400
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Specifications
| Attribute | Value |
| Packaging | BGA |
| Clock Frequency | 800MHz |
| Memory Format | DDR3L SDRAM |
| Memory Size | 4Gbit |
| Operating temperature | -40℃~+95℃ |
| Voltage - Supply | 1.283V~1.45V |
Overview
Description
This memory chip is suitable for various applications, including servers, networking equipment, and embedded systems. It has a 78-ball TFBGA package, enabling compact designs. The E at the end signifies compliance with the RoHS directive, ensuring it is free from hazardous substances. Overall, the MT41K256M16HA-125IT:E is a reliable solution for modern computing needs, balancing speed, capacity, and thermal performance.
Equivalent
1. Hynix H5TQ4G63AFR-PBA
2. Samsung K4B4G1646F-BCK0
3. Micron MT41K256M16HA-125
4. Elpida EDBS4L032G1AE
5. Nanya NT5CB256M16DP-DI
Ensure compatibility with your specific application requirements before substitution.
Features
- Speed: Operates at a data rate of 1600 MT/s.
- Voltage: Requires a supply voltage of 1.5V with a low-power option of 1.35V for reduced energy consumption.
- Package Type: Offered in a 78-ball FBGA (Fine Ball Grid Array) package.
- Thermal: Designed for temperatures ranging from 0°C to 95°C.
- Features: Supports various functionalities such as burst lengths of 8/4, random access, and high-speed data transfer.
- Compatibility: Ideal for use in applications like laptops, desktops, and servers.
This component is suitable for high-performance applications, providing a balance of speed and efficiency in memory performance.
Pinout
The primary functions of the pins include:
- Data Pins (DQ0-DQ15): Used for data input and output.
- Address Pins (A0-A12): Used to select memory locations.
- Control Pins (CS, RAS, CAS, WE): Used to control operations such as read, write, and refresh.
- Clock Pins (CLK, CLK#): Used for synchronization of data transfers.
- Power Pins (VDD, VSS): Provide power supply and ground connection.
- Other Pins (ODT, DM, etc.): For on-die termination and data mask functions.
This device operates at a clock frequency of 125 MHz and supports various DDR3 features, including burst lengths and bank activation.
Manufacturer
Application
Package
Frequently Asked Questions
Q: What is the operating temperature range of this DDR3L memory?
A: The MT41K256M16HA-125IT:E operates from -40°C to +95°C, suitable for industrial and extended temperature applications.
Q: What voltage supply does this component require?
A: It requires a nominal voltage of 1.283V to 1.45V, compatible with DDR3L (low voltage) standards for reduced power consumption.
Q: What is the memory format and density of this part?
A: It is a DDR3L SDRAM with a density of 4Gbit (256M x 16 organization), ideal for high-density computing.
Q: Can this memory be used in high-speed embedded systems?
A: Yes, with a clock frequency of 800MHz, it supports fast data rates, suitable for networking and industrial controllers.
Q: What package type does the MT41K256M16HA-125IT:E use?
A: It comes in a BGA (Ball Grid Array) package, enabling compact PCB layout and reliable soldering.