MXD8621C

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MXD8621C

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Specifications

Attribute Value
Manufacturer Maxscend
Package DFN-6(0.7x1.1)
Voltage-Supply 2.5V~3V
Frequencyrange 100MHz~3GHz
isolation 25dB
Insertionloss 0.45dB
operatingtemperature -30℃~+85℃

Overview

Description

The MXD8621C is a high-performance, dual-channel, digital isolator from Maxim Integrated (now part of Analog Devices). It provides robust galvanic isolation (up to 5 kV RMS) for signal transmission between circuits, ensuring noise immunity and safety in industrial, medical, and automotive applications.
Key features:
- Dual-channel isolation (bidirectional or unidirectional configurations).
- High-speed data rates (up to 150 Mbps).
- Low power consumption and low propagation delay.
- Wide supply voltage range (2.5V to 5.5V).
- Robust EMC performance (IEC 61000-4-x compliance).
Ideal for SPI, I²C, RS-485, and PWM isolation, the MXD8621C enhances system reliability in noisy environments. Its compact package (SOIC-8) makes it suitable for space-constrained designs.
For detailed specs, refer to the datasheet or Analog Devices' official documentation.

Features

The MXD8621C is a high-performance, dual-channel digital isolator with the following key features:
- Dual-Channel Isolation: Provides two independent isolation channels.
- High-Speed Data Rate: Supports up to 150 Mbps for fast signal transmission.
- Wide Voltage Range: Operates with 2.5V to 5.5V supply voltages.
- Robust Isolation: Offers 5 kVrms isolation for safety and noise immunity.
- Low Power Consumption: Optimized for energy-efficient applications.
- Wide Temperature Range: Works from -40°C to +125°C for harsh environments.
- CMTI (Common-Mode Transient Immunity): High >100 kV/µs for reliable performance in noisy conditions.
- Small Package Options: Available in SOIC-8 and other compact formats.
Ideal for industrial, automotive, and communication systems requiring reliable signal isolation.

Package

The MXD8621C is available in a 5x5 mm, 32-pin QFN (Quad Flat No-Lead) package. This compact, surface-mount package offers efficient thermal performance and space-saving design, suitable for high-density PCB applications. Key features include exposed pads for enhanced heat dissipation and a lead-free, RoHS-compliant construction.

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