OMAP3530DCUSA

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OMAP3530DCUSA

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IC MPU OMAP-35XX 720MHZ 423FCBGA

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Specifications

Attribute Value
Supplier Rochester Electronics, LLC,Texas Instruments
Package Tray,Tray
Series OMAP-35xx
ProductStatus Obsolete
CoreProcessor ARM® Cortex®-A8
NumberofCores/BusWidth 1 Core, 32-Bit
Speed 720MHz
Co-Processors/DSP Signal Processing; C64x+, Multimedia; NEON™ SIMD
RAMControllers LPDDR
GraphicsAcceleration Yes
Display&InterfaceControllers LCD
USB USB 1.x (3), USB 2.0 (1)
Voltage-I/O 1.8V, 3.0V
OperatingTemperature -40°C ~ 105°C (TJ)
Package/Case 423-LFBGA, FCBGA

Overview

Description

OMAP3530DCUSA is TI’s OMAP3530 system-on-chip, part of the OMAP3 family, designed for multimedia mobile devices. It combines an ARM Cortex-A8 application processor with a TI DSP (C64x+) and dedicated imaging/video accelerators, enabling smooth video playback, camera processing, and graphics. The SoC includes an integrated memory controller, peripherals (USB, LCD/camera interfaces), and power-management features for battery-powered devices. It supports multimedia codecs and 2D/3D graphics acceleration, making it suitable for smartphones, PDAs, and other portable devices from the late 2000s. DCUSA likely denotes a specific package/variant used by a vendor or reference design; consult TI’s datasheet or device documentation for exact features, pinout, and clocking. In short: a high-performance, multimedia-oriented mobile SoC from TI designed to run mobile OSes with efficient power usage.

Equivalent

There isn’t an exact external substitute with the same package/pinout. The closest equivalents are other OMAP3 Cortex-A8 parts from TI, e.g. OMAP3430, OMAP3515, and OMAP3525 (similar CPU/peripherals). Differences lie in memory interface and peripherals. For exact cross-reference, check TI’s cross-reference data or distributor listings for the OMAP3530DCUSA family variant.

Features

OMAP3530DCUSA features (highlights):
- Application CPU: ARM Cortex-A8 core up to about 600 MHz
- DSP: TI TMS320C64x+ DSP co-processor for signal processing
- Graphics: 2D/3D engine (PowerVR SGX530)
- Multimedia: IVA2 imaging/video accelerator with hardware decode for MPEG-4, H.263, H.264 (encode/assist for select formats)
- Image/Video: camera interface and display subsystem for LCD/TV output
- Memory: external DDR2/LPDDR SDRAM interface
- Peripherals: USB 2.0 (OTG/host), multiple UARTs, I2C, SPI, PWM, MMC/SD
- Audio: I2S/PCM and multi-channel audio support
- Power: dynamic voltage/frequency scaling and multiple power domains for low power
- Process: 65 nm manufacturing
Note: exact clock speeds, memory capacities, and codec levels depend on specific board/system integration.

Pinout

- Pin count: 343 pins (BGA package for the DCUSA variant).
- Function: OMAP3530DCUSA is the OMAP3530 System-on-Chip in that package, featuring an ARM Cortex-A8 CPU (with NEON), an integrated TI DSP (TMS320C64x), and multimedia/graphics engines plus memory/controllers and I/O peripherals for embedded/smartphone use.

Manufacturer

- Manufacturer: Texas Instruments (TI).
- What kind of company: TI is an American multinational corporation that designs and manufactures semiconductors and integrated circuits, focusing on analog and embedded processing products (headquartered in Dallas, Texas).

Application

OMAP3530DCUSA (OMAP3530) is a multimedia-enabled application processor. Common application areas include:
- Smartphones and mobile Internet devices
- Portable media players and handheld gaming
- Automotive infotainment and navigation systems
- Set-top boxes, IPTV/digital TV and home media hubs
- Embedded consumer electronics (digital cameras, camcorders, dashcams)
- Industrial/medical embedded systems and development platforms (e.g., BeagleBoard)
Its ARM Cortex-A8 core plus integrated multimedia processing enable rich video, audio, camera and graphics features for these domains.

Package

It’s a BGA (ball-grid array) package — the OMAP3530DCUSA variant uses an FBGA-style package.

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